Defence Statutory Bodies & Commissions/Committees Closing in 4 days TDR #56233290

Bids Are invited for Motherboard

Issued by Statutory Bodies & Commissions/Committees · Jammu, Jammu and Kashmir
Tender Value
Ref. Documents
Estimated cost
Bid Submission
10 Jul 2026
4 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Organization
Click here to view tendering authority
Tender ID
Click here to view tender id
Competition Type
NCB
Bidding Type
Tender
Location / State
Jammu → Jammu and Kashmir
EMD Exemption
Not Available
Quantity
9
Website
Click here to view website
Contact Person
Click here to view contact person
Address
Click here to view address

Project Description

Bids Are invited for Motherboard Logic Card Hp 108 , Processor , Ram Ddr4 8Gb , Smps , Motherboard Total Quantity : 9

BOQ

Sl. No. Item TitleItem Description
1LOGIC CARD HP 108LOGIC CARD HP 108
2PROCESSORPROCESSOR
3RAM DDR4 8GBRAM DDR4 8GB
4SMPSSMPS
5MOTHERBOARDMOTHERBOARD

AI Tender Summary

OUR REF NO 56233290
AUTHORITY Statutory Bodies & Commissions/Committees
TENDER VALUE Ref. Documents
LAST DATE 10-07-2026
Authority
Authority Name Indian Army
Work Description Bids Are invited for Motherboard Logic Card Hp 108 , Processor , Ram Ddr4 8Gb , Smps , Motherboard Total Quantity : 9
Basic Detail
Tender No GEM/2026/B/7728293
Bidding Type Tender
Location
City Jammu
State Jammu and Kashmir
Key Dates
Publish Date 30 Jun 2026
Submission Date 10 Jul 2026
Open Date 10 Jul 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Not Available
Document List
a79570be-3d69-43ed-93de-4acb1cc7affb.pdf
9540313_Boq_1.xlsx
motherboard_i5_description_2026-06-30-18-50-18_a3676637f669af67ee9fa30f7743d342.pdf
AI-generated summary — verify details from the official tender portal before submission.

Unlock Full AI Tender Summary

Get instant access to the complete AI-generated analysis — scope, eligibility, timeline & more.

Instant Access Secure Free
Your details are secure and used only for document delivery.

Tender Timeline

Jun 30, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Jul 10, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 4 days
Jul 10, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 4 days

Tender Documents

Download All (ZIP) ↓
pdf

a79570be-3d69-43ed-93de-4acb1cc7affb.pdf

xlsx

9540313_Boq_1.xlsx

pdf

motherboard_i5_description_2026-06-30-18-50-18_a3676637f669af67ee9fa30f7743d342.pdf

Disclaimer

We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender

TenderDetail
Loading tenders