Tender For Rate Contract For Procurement Of Tscd Wafers For Sterile Connecting Device For Department Of Tmbb At Aiims Bhopal
Tender Overview
Project Description
Tender for Rate Contract For Procurement Of Tscd Wafers For Sterile Connecting Device For Department Of Tmbb At Aiims Bhopal , Tscd Wafer (Product Code: Sc*W017)
Corrigendum
| Sr No | Corrigendum Date | Corrigendum | Type | New Submission Date |
|---|---|---|---|---|
| 1 | 30-Jun-2026 | Bid Auto Extn Corrigendum | Bid Auto Extn Corrigendum | 07-Jul-2026 |
| 2 | 07-Jul-2026 | Bid Auto Extn Corrigendum | Bid Auto Extn Corrigendum | 13-Jul-2026 |
| 3 | 13-Jul-2026 | Bid Auto Extn Corrigendum | Bid Auto Extn Corrigendum | 16-Jul-2026 |
BOQ
| Sl. No. | Item Description |
| 1 | TSCD WAFER (Product Code: SC*W017) Please Enable Macros to View BoQ information |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedCorrigendum-1 Issued
Clarifications on tender conditions and amendments issued.
CompletedCorrigendum-2 Issued
Clarifications on tender conditions and amendments issued.
CompletedCorrigendum-3 Issued
Clarifications on tender conditions and amendments issued.
Upcoming · 1 dayBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 1 dayBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 2 daysTender Documents
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