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| 1 | UHV Chamber Specification (vacuum better than 2×10-9 mbar UHV) Chamber Overview Spherical (diameter ≥ 14”) or equivalent square shaped UHV chamber with support frame equipped with three (3) X 2-inch magnetron sputtering sources. All CF Flanges and UHV Viewports/SS blanks |
| 2 | Three (3) X 2-inch magnetron sputtering sources. Each sputtering source has an individual gas inlet line for process gases. All CF Flanges. |
| 3 | Substrate holder : Diameter: 2 inches; heating Molybdenum heater capable of heating substrate (a) from room temperature (RT) to 800°C during rotation and (b) from room temperature to 1000°C without rotation. Rotation: Substrate holder can rotate continuously, driven by a stepper motor. Variable speed from 0 to 10 RPMMovement: Up / down vertical movement of total 25mm to adjust substrate position during deposition Sputtering geometry: One sputtering source mounted parallel to the substrate surface, tilt adjustable. Two sputtering sources mounted confocally at an angle relative to the substrate. Base pressure: lower than 2 × 10⁻⁹ mbar (ultra-high vacuum). |
| 4 | Vacuum Pumping System: Turbo Molecular Pump: Pfeiffer HiPace300 / Edwards nEXT 300 / Leybold Turbovac 350i with CF100 flange or equivalent with integrated controller |
| 5 | Ion Pump with controller: Included to maintain UHV vacuum levels and provide clean pumping. |
| 6 | Backing Pump: Pfeiffer HiScroll 12 / Edwards nXDS 15i / Leybold scroll VAC 15 plus or equivalent dry scroll pump used to back TMP |
| 7 | Gate Valves : One CF100 and one CF150 manual Gate valves for isolating the chamber from the pumping systems as well as throttling |
| 8 | Vacuum Gauges and Measurement: One Cold cathode gauge with readout capable of measuring vacuum pressures down to1×10-10 mbar for precise UHV monitoring. |
| 9 | One Capacitance manometer gauge with measurement range from 1× 10-1 to 1 × 10⁻³ mbar for accurate pressure reading during deposition phase |
| 10 | Gas Delivery System: Two independent Mass Flow Controllers (MFCs):a. One MFC (0-100 sccm) for Argon gas feeding to all three sputtering sources via high vacuum valves.b. One MFC (0-100 sccm) for Nitrogen gas feeding directly into the chamber with its own high vacuum valve.Gas lines for Ar and N2 are physically separated to avoid cross-contamination. |
| 11 | Chamber Access and Viewports: 1. Two view ports installed on the chamber, each equipped with manual shutters. 2. Access Ports for gauges, pump, gas inlet and few spares for future upgradation. |
| 12 | Baking Capability: Entire chamber designed to bake-out at 150°C to reduce contamination and out gassing during operation |
| 13 | Cooling Capability : Water manifold with flow switch / flow meters |
| 14 | Near UHV Chamber Specification: Chamber Overview: Spherical (diameter ≥ 14”) or equivalent square shaped UHV Chamber with stand. |
| 15 | Three 2-inch magnetron sputtering sources, each with individual gas inlet. All CF Flanges and UHV Viewports/SS blanks. |
| 16 | Substrate holder: a. Diameter: 2inches; heating : Molybdenum heater capable of heating substrate (a) from room temperature (RT) to 800°C during rotation and (b) from room temperature (RT) to 1000°C without rotation b. Rotation : Substrate holder driven by stepper motor. Variable speed from 0 to10 RPMMovement: Up / down vertical movement of total 25mm to adjust substrate position during deposition Sputtering geometry: One sputtering source mounted parallel to substrate surface (tilt able preferred). Two sputtering sources mounted confocally at an angle. Base pressure : lower than 5× 10⁻⁸ mbar (Near UHV). |
| 17 | Vacuum Pumping System: Turbo Molecular Pump : Pfeiffer HiPace 700 / Edwards nEXT 730 / Leybold Turbo vac 900 iX or equivalent with CF100 flange and integrated controller, suitable for Near UHV vacuum. |
| 18 | Backing Pump: Pfeiffer Hi Scroll 12/Edwards nXDS15i / Leybold scroll vac 15 plus or equivalent dry scroll pump used to back TMP |
| 19 | Gate Valves: One CF150 manual gate valve to isolate / throttle chamber from pumping system |
| 20 | Vacuum Gauges and Measurement: Cold cathode readout capable of displaying vacuum pressures down to 1 × 10-8 mbar |
| 21 | Capacitance manometer gauge with measurement range from 1×10⁻¹ to 1×10⁻³ mbar for accurate pressure reading during deposition phase. |
| 22 | Gas Delivery System: Two independent Mass Flow Controllers (MFCs):a. One MFC (0-100sccm) for Argon feeding all three sputtering sources through high vacuum valves. b.One MFC (0-100sccm) for Nitrogen feeding chamber gas inlet through high vacuum valve.Separate gas lines for Ar and N2 gases. |
| 23 | Chamber Access and Viewports: One CF100 door (with possibility of sample loading and unloading) on chamber with viewport for observation and access |
| 24 | Ports for gauges, pump, gas inlet and few spares for future upgradation |
| 25 | Cooling Capability: Water manifold with flow switch / flow meters. |
| 26 | Load Lock Chamber Specification (Base pressure: lower than 1 × 10-6 mbar) Chamber Overview: An appropriate sized spherical or equivalent square shaped Load-lock chamber with stand equipped with one 2-inch magnetron sputtering source mounted at bottom of the chamber with Argon gas inlet. |
| 27 | Ports for gauges, pump, gas inlet, transfer arm etc. Appropriate view ports and transfer ports (CF 63) to connect to two above chamber, Loading port. |
| 28 | Substrate holder: Diameter: 2 inches; Room temperature operation; Rotation of substrate holder; Up/down vertical movement of 25mm in-situ |
| 29 | Vacuum Pumping System: Turbo Molecular Pump: Pfeiffer HiPace300/ Edwards nEXT 300/ Leybold Turbovac 350i or equivalent with CF100 flange and integrated controller |
| 30 | Backing Pump: Pfeiffer HiScroll 12/ Edwards nXDS15i / Leybold scroll vac 15 plus or equivalent dry scroll pump used to back TMP. |
| 31 | Valves: a.One manual CF100 gate valve for TMP isolation.b. Two manual CF100 gate valves for substrate transfer (sized for 2\\" samples). |
| 32 | Vacuum Gauges and Measurement: Cold cathode gauge with readout for vacuum measurement |
| 33 | Pirani gauge for rough vacuum measurement |
| 34 | Gas Delivery System: Two independent MFCs (0-100 sccm):a. One for Argon feeding the sputtering source through high vacuum valve. b. One for Oxygen feeding chamber through high vacuum valve.Separate gas lines for Ar and O2. |
| 35 | Chamber Access and Viewports: Appropriate high vacuum compatible view port installed along with Quick access to the chamber throughCF150 front door |
| 36 | Transfer System: Two magnetic transfer arms for substrate movement between Load Lock, Near UHV and UHV chambers. And one spare transfer arm. |
| 37 | Instrumentation and Electronics: Instrumentation rack housing all controllers, electronics, and power distribution components. |
| 38 | An additional sample transfer rod |
| 39 | UPS (based on the total load) |
| 40 | Power Supplies: a. One(1)× 600W DC power supplies for sputtering sources. b. One (1) × 300W RF power supply for RF sputtering or substrate biasing. c. Controllers for substrate rotation, heating, and stepper motor control. d. Integrated water flow sensors with interlock systems to monitor and ensure proper cooling. |
| 41 | Cooling System: 1. Each chamber equipped with individual water manifolds. Water manifolds connected to a common chiller system rated for 2kW cooling capacity. .2.Cooling system designed to cool:7 sputtering magnetron sources.2 substrate heaters (UHV and ear UHV chambers). Please Enable Macros to View BoQ information |
