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| 1 | Spares for Dicing Saw (Disco, DAD 3660) |
| 2 | Ceramic IC Package - 8 pin CSOP (die cavity 3.3mm x 3.3mm) |
| 3 | Ceramic IC Package - 14 pin CSOP (die cavity 3.81mm x 3.81mm) |
| 4 | Sealing Lid With Perform; Drawn OD 250mils x 250mils ID 210mils x 210mils |
| 5 | Ceramic IC Package -14pin CSOP (die cavity 6.47mm x 3.96mm) |
| 6 | Sealing Lid With Perform; Drawn OD 380 mils x 245mils, ID 0340mils x 215mils |
| 7 | Ceramic IC Package - 16pin CSOP (die cavity 4.19mm x 3.81mm) |
| 8 | Sealing Lid With Preform: Drawn OD300 mils x 250mils ID 250mils x 205mils |
| 9 | Ceramic IC Package 22 Pin CDIP, Die cavity: 7.11mm x 6.6mm |
| 10 | Sealing Lid with Preform (LWP) - OD407 x 370 ID 410 x 345 |
| 11 | Ceramic IC Package - 24 pin CQFP (die cavity 8mm x 8mm) |
| 12 | Sealing Lid With Preform: OD476 mils x 476 mils ID 445 mils x 445 mils |
| 13 | Ceramic IC Package 28 Pin CDIP, Die cavity: 5.58mm x 5.58mm |
| 14 | Sealing Lid with Preform: OD493 mils X 493 mils ID 423 mils X 423mils |
| 15 | Ceramic IC Package - CLCC 28 Pin (cavity size 5mm sq) |
| 16 | Sealing Lid With Step for Seam sealing OD 9.11mm sq |
| 17 | Ceramic IC Package - CLCC 44Pin (Cavity size 6.35mm sq) |
| 18 | Sealing Lid With step for Seam sealing OD 11.4mm sq |
| 19 | Ceramic IC Package CLCC 44 (Cavity 12mm x 12mm) |
| 20 | Sealing Lid With Preform OD 620\\" ID 570\\" |
| 21 | Ceramic IC Package - 48 pin CDFP ( dia cavity 4mm x 5.3mm) |
| 22 | Ceramic IC Package - 48 pin CDEP (die cavity 4 mm x 8.65 mm) |
| 23 | Sealing Lid With Preform: LWP OD 472mils x 360mils, ID420mils x 308mils |
| 24 | Ceramic IC Package - 64 pin CQFP (die cavity 5.6 mm x 5.6 mm) |
| 25 | Sealing Lid With Preform: LWP OD 362 mils x 362 mils, ID 323 mils x 323 mils |
| 26 | Ceramic IC Package CLCC 68 Pin (cavity size 8.12mm sq) |
| 27 | Sealing Lid WithStep for Seam Sealing OD 12.42 mmsq |
| 28 | Ceramic IC Package 68 Pin CQFJ, (Die cavity: 8.255 mmx 8.255mm) |
| 29 | Sealing Lid with Preform (LWP)-OD 590mils x 590mils ID 520mils x 520mils) |
| 30 | Ceramic IC Package CLCC 84 Pin (cavity size 8.89 mm sq) |
| 31 | Sealing Lid WithStep for Seam Sealing OD 16.48 mm sq |
| 32 | Ceramic IC Package 100 Pin Cerquad Lead frame , (Die cavity: 8.99 mmX8.99 mm) |
| 33 | Sealing Lid with Frit Glass Ceramic OD:787x551 mils ID 689 x 449mls |
| 34 | Ceramic IC Package - 132 pin CQFP (die cavity 10.16 mm x 10.16 mm) |
| 35 | Ceramic IC Packge132 Pin CQFP ((Die cavity: 11.4 mm sq ) |
| 36 | Sealing Lid With Preform: LWP OD 710 mils x 710 mils, ID 660 mils x 660 mils |
| 37 | Ceramic IC Package 208 Pin CQFP , (Die cavity: 9.5 mm x 9.5 mm) |
| 38 | Ceramic IC Package 208 Pin CQFP , (Die cavity: 12 mm x 12 mm) |
| 39 | Sealing Lid With Step for Seam Sealing OD 20.6 mmsq |
| 40 | Ceramic IC Package 256 Pin CQFP, Die cavity: 16.5 x 16.5 |
| 41 | Sealing Lid With Preform: LWP OD: 867x867, ID: 803x803 mils |
| 42 | Ceramic IC Package 20 Pin CDFP, Die cavity: 6.350 x 3.556 |
| 43 | Sealing Lid With Preform LWP OD460X280 ID420x240 |
| 44 | Ceramic IC Package - 10 pin CSOP (die cavity 3.3mmsq) Please Enable Macros to View BoQ information |
