Laying Of 150Mm Dia Di Water Supply Line And 300X250mm Junction Work To Provide Water Supply To 40Mm Dia Water Supply Connection To Ch. Srinivas Reddy And Others Dagpa Sivah Buid Con By Its Managing Partner M Siva Gopal Vide File No.2025-11-2652 Und, Hyderabad-Telangana
TDR : 55286500
Tender Notice
6 Days Left
Hyderabad
Telangana
Laying of 150mm dia DI water supply line and 300x250mm junction work to provide water supply to 40mm dia water supply connection to CH. Srinivas Reddy and others Dagpa sivah buid con by its managing partner M siva Gopal vide File no.2025-11-2652 und
We takes all possible care for accurate & authentic tender information, however Users
are requested to refer Original source of Tender Notice / Tender Document published by
Tender Issuing Agency before taking any call regarding this tender.
