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    • Tender For Fabrication, Packaging And Supply Of Naada2.0 Asics In Tsmc 55Nm Ulp Eflash Process , Cost: Mpw 55 Nm Ulp Eflash Actual Block Size After Shrink:8Mm2 , Nre: 565 Nm Cmos Ulp Eflash , Nre: Ip Merge & Lvs , Cost For Die Sawing , Cost: Qfn40 (5Mmx5m, Thiruvananthapuram-Kerala

    TDR : 54413922
    • Tender Notice
    • BOQ
    7 Days Left
    Thiruvananthapuram Kerala
    Tender For Fabrication, Packaging And Supply Of Naada2.0 Asics In Tsmc 55Nm Ulp Eflash Process , Cost: Mpw 55 Nm Ulp Eflash Actual Block Size After Shrink:8Mm2 , Nre: 565 Nm Cmos Ulp Eflash , Nre: Ip Merge & Lvs , Cost For Die Sawing , Cost: Qfn40 (5Mmx5M
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