Tender For Manual Wire Bonder And Kits, kharagpur-West Bengal

Tender For Manual Wire Bonder And Kits; 1 Bond types Thin wire Ball-Wedge, Wedge-Wedge Deep Access & Ribbon bonding Bond head Bond head capable to do the following:  Ball-Wedge (Ø 17,5 - 50μm) for gold wire.  Wedge-wedge (Ø 17,5 - 75μm) for Gold and Aluminium wire.  System should have shuttle wheel or mousecontrolled stage or suitable method for optical userfriendly bonding and parameter adjustment.  Programmable loop geometry and bond foot length 2 Wire feed angle  90 degrees  Dual/Single Wire clamping System to keep the wire under control 3 Bond material Gold wire, and Cu/Al/Ag wire 4 X & Y micromanipulator Motorized X Y table Travelling distance: minimum 40 x 40 mm 5 Y axis Movement  Motorized Y-Axis with 20 to 40 mm or more travel  Manipulator Ratio at least 1:6 or more precise 6 Z axis Movement  Programmable motorized Z-axis with minimum 40 to 58 mm or more travel.  Stepper motor driven Z-linear axis with step precision 1 μm or better 7 Working height 50 mm or more 8 Recipe storage  Should be able to store & run unlimited no of recipes.  To be able to program single Bonds & save loop shapes. 9 Ultrasonic frequency 62-67 KHz or equivalent 10 Bond force From 5 up to 500cN or more, programmable 11 Temperature range Working temperature from ambient to 220 ° C or more 12 Substrate holder  Workholder for parts up to 50mm or more,  Should be heated with vacuum + mechanical clamping  Ceramic plate gold plated 2x2 inch 13 Vacuum pump Suitable vacuum pump to be provided 14 Display Color display of at least 10 inches or larger, 15 Touch down Contactless electronic touchdown-sensor 16 Loop shapes and bonding parameter  Should be programmable – Standard, rectangular, reverse, stitch etc.  Should be able to program the distance (loop length) between source and destination bonds. 17 Bonding tools & Wires spools 1. Ball-Wedge (AU 17.5µm) Capillary and gold wire. 2. Required tool kit should be provided 3. Ball-Wedge Cu-Kit should be provided 18 In-built optical path for sample handling  Stereo-Zoom-Microscope with magnification of 50x or more.  Should include HDMI camera and monitor 20 Delivery The system must be delivered within 12-15 weeks from the purchase order date 21 Training Onsite training by trained engineer about operation, basic routine maintenance & repair 22 Installation To be done at IIT Kharagpur by trained engineers. Equipment footprint along with other specific utilities to be provided by the supplier (if any) 23 Acceptance Criteria Demonstrate ball wedge bonding on chips provided by user. Die pickup and place also should be tested at user site. 24 Terms & Condition 1. Vendor to provide brand new certificate for the system 2. The system should be clean room compatible 3. Vendor to provide 7 years support including spares after warranty 25 Optical Microscope for Sample processing with 150mm x 100 mm moving stage, Reflected Light Illuminator, Bright and dark field capability Light Balancing Amber Filter, Trinocular tube, Wafer Holder Objective 5X, 10X, 20X, 50X, 100X, and LWD 50X 26. Spin Coater Speed: 50 – 12000 RPMAcceleration: 1 to 8000 RPM/s Drive System: BLDC Motor Standard Chucks: 1 Vacuum Chuck (10mm * 10mm to 2” dia. Substrate) 1 Universal Vacuum Chuck (20 mm * 20 mm to 4″ dia. Substrates) 1 Universal Vacuum-Less Chuck (25 mm * 25 mm, 25 mm * 75 mm and 2”, 3” & 4” diameter substrates) Drainpipe: Polypropylene Pipe at the side of chamber Housing Material: Corrosion-free Powder Coated Sheet Metal – Glove Box Compatible Time per Program: 10000 seconds User Interface: Semi Integrated Android Based Touch Display Live RPM: Yes Live Program Time: Yes Program Steps: 10 steps per program (100 Steps Customizable) Storage Capacity: Unlimited Programs Substrate Holding Mechanism: Vacuum, Vacuum-Less & Hybrid OPTIONAL PURCHASE: Customized Chuck (Vacuum or Vacuum-Less) to hold substrates from 5 to 100 mm dia. Substrate Size: 5 to 100 mm diameter Working Chamber Material: Solid Natural Polypropylene Working Chamber Size: 6” Diameter; 3” Height Substrate Holding Vacuum: 650 mmHg Maximum Vacuum Connections: 10mm PU hose – 2m length – default Integrated Vacumm Switch (ON/OFF): Yes Spirit Level: External Safety Feature: Lid Interlock safety for open cover Liquid Dispensing: Centre Hole in the Lid for liquid dispensing Lid Material: Translucent Brown Acrylic Lid (Compatible for Photo-Resist coating) Nitrogen Purging: Pneumatic connection in the lid for Nitrogen Purging Dimensions (L, B, H): 260 × 260 × 320 mm (Without Drain & Display) Power Requirement: 220V AC/50Hz; DC Adapter will be provided Warranty: 12 months warranty with 3 years of support Installation Support: Refer to Installation Videos (Unpacking + Installation + Working Videos) Add-Ons & Accessories: Oil-Free Vacuum Pump IR Heating (RT – 200°C) 26 Computer  OS: Windows 10/11 Pro x64 /CORE i7 Processor  RAM 16GB / 512 Storage  Integrated graphics  USB-4 ports/ Ethernet Port  Monitor (IPS LCD/LED /Keyboard/Mouse) 27 Warranty 1. The main component of wire bonder system should be covered for a comprehensive warranty for at least 3 years from the manufacturer, which will start from the date of the successful installation and commissioning of the equipment. 2. The spin coater system should be 12 months warranty with 3 years of support

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