Defence Statutory Bodies & Commissions/Committees Closing in 0 days TDR #52330175

Bids Are Invited For Upgrade And Ruggedisation Of By 25-2C Total Quantity : 5

Issued by Statutory Bodies & Commissions/Committees · Pune, Maharashtra
Tender Value
Ref. Documents
Estimated cost
Bid Submission
04 Dec 2025
0 days left
EMD
2.36 Lakhs
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Competition Type
NCB
Bidding Type
Tender
Location / State
Pune → Maharashtra
EMD Exemption
Not Available
Quantity
Not Available

Project Description

Bids Are Invited For Upgrade And Ruggedisation Of By 25-2C -1. Microcontroller Hardware Platform Not present Atmel AVR Controllers viz, AT mega2560/2561 or STM32 based L4 / F4 Series, ARM Cortex-M4 with internal flash, timers, ADC, PWM, & GPIO or equivalent 2. Software/Firmwar e Platform Not present Bare-metal C (or Arduino-style) Firmware; written for deterministic control flow, with fault handling and boot self-test or higher 3. Schematic Design Not Applicable (electromechanical wiring) Created in KiCad/Altium/Eagle for digital logic, display drivers, protection components, and MCU interfaces 4. Software Simulation Not Applicable (electromechanical wiring) Simulation of circuit logic, display response, and switch debounce in software (Proteus, KiCad or STM32CubeMX simulation, if applicable) 5. Gerber Generation NA Generated using KiCad/Altium; includes copper layers, silkscreen, solder mask, and drill files 6. PCB Specifications NA PCB Type : Rigid, Single/Double/4- layer FR4 Layers : Typically 2 or 4 layers depending on complexity Base Material : FR4 (Industrial Grade), or High Tg FR4 for thermal stress Thickness : 1.6 mm (standard) or 2.0 mm if needed for strength Copper Thickness : 1 oz/ft² (35 µm) standard; 2 oz for higher current paths Surface Finish : ENIG (Electroless Nickel Immersion Gold) for reliability Soldermask Color : Green (standard), or black/blue/red as required Silkscreen : White on component side 7. Wiring NA MIL-grade PTFE (Teflon) insulated wires with crimp/soldered terminals; connected via panel MS/IP67 connectors 8. Protection Measures NA Snubber circuits for relay coilsReverse polarity & ESD protection (TVS Diodes wherever applicable)- Opto-isolators for signal inputs- Series resistors and capacitors for filteringConformal coating Total Quantity : 5

AI Tender Summary

OUR REF NO 52330175
AUTHORITY Statutory Bodies & Commissions/Committees
TENDER VALUE Ref. Documents
LAST DATE 04-12-2025
Authority
Authority Name Indian Army
Work Description Bids Are Invited For Upgrade And Ruggedisation Of By 25-2C -1. Microcontroller Hardware Platform Not present Atmel AVR Controllers viz, AT mega2560/2561 or STM32 based L4 / F4 Series, ARM Cortex-M4 with internal flash, timers, ADC, PWM, & GPIO or equivalent 2. Software/Firmwar e Platform Not present Bare-metal C (or Arduino-style) Firmware; written for deterministic control flow, with fault handling and boot self-test or higher 3. Schematic Design Not Applicable (electromechanical wiring) Created in KiCad/Altium/Eagle for digital logic, display drivers, protection components, and MCU interfaces 4. Software Simulation Not Applicable (electromechanical wiring) Simulation of circuit logic, display response, and switch debounce in software (Proteus, KiCad or STM32CubeMX simulation, if applicable) 5. Gerber Generation NA Generated using KiCad/Altium; includes copper layers, silkscreen, solder mask, and drill files 6. PCB Specifications NA PCB Type : Rigid, Single/Double/4- layer FR4 Layers : Typically 2 or 4 layers depending on complexity Base Material : FR4 (Industrial Grade), or High Tg FR4 for thermal stress Thickness : 1.6 mm (standard) or 2.0 mm if needed for strength Copper Thickness : 1 oz/ft² (35 µm) standard; 2 oz for higher current paths Surface Finish : ENIG (Electroless Nickel Immersion Gold) for reliability Soldermask Color : Green (standard), or black/blue/red as required Silkscreen : White on component side 7. Wiring NA MIL-grade PTFE (Teflon) insulated wires with crimp/soldered terminals; connected via panel MS/IP67 connectors 8. Protection Measures NA Snubber circuits for relay coilsReverse polarity & ESD protection (TVS Diodes wherever applicable)- Opto-isolators for signal inputs- Series resistors and capacitors for filteringConformal coating Total Quantity : 5
Basic Detail
Tender No GEM/2025/B/6793915
Bidding Type Tender
Location
City Pune
State Maharashtra
Key Dates
Publish Date 13 Nov 2025
Submission Date 04 Dec 2025
Open Date 04 Dec 2025
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD 2.36 Lakhs
Exemption Not Available
Document List
tech_specs_by252c_2025-10-15-14-33-56_7a1512ca9dbc3aee5aa6b49ef3165270.pdf
e3a68714-286e-41ef-b7a5-9740f79df40e.pdf

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Tender Timeline

Nov 13, 2025
11:30 IST

Tender Published

Tender notice published.

Completed
Dec 04, 2025
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Completed
Dec 04, 2025

Bid Opening Date

Technical bids will be opened and evaluated.

Completed

Tender Documents

Download All (ZIP) ↓
pdf

tech_specs_by252c_2025-10-15-14-33-56_7a1512ca9dbc3aee5aa6b49ef3165270.pdf

pdf

e3a68714-286e-41ef-b7a5-9740f79df40e.pdf

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