Bids Are Invited For Upgrade And Ruggedisation Of By 25-2C Total Quantity : 5
Tender Overview
Project Description
Bids Are Invited For Upgrade And Ruggedisation Of By 25-2C -1. Microcontroller Hardware Platform Not present Atmel AVR Controllers viz, AT mega2560/2561 or STM32 based L4 / F4 Series, ARM Cortex-M4 with internal flash, timers, ADC, PWM, & GPIO or equivalent 2. Software/Firmwar e Platform Not present Bare-metal C (or Arduino-style) Firmware; written for deterministic control flow, with fault handling and boot self-test or higher 3. Schematic Design Not Applicable (electromechanical wiring) Created in KiCad/Altium/Eagle for digital logic, display drivers, protection components, and MCU interfaces 4. Software Simulation Not Applicable (electromechanical wiring) Simulation of circuit logic, display response, and switch debounce in software (Proteus, KiCad or STM32CubeMX simulation, if applicable) 5. Gerber Generation NA Generated using KiCad/Altium; includes copper layers, silkscreen, solder mask, and drill files 6. PCB Specifications NA PCB Type : Rigid, Single/Double/4- layer FR4 Layers : Typically 2 or 4 layers depending on complexity Base Material : FR4 (Industrial Grade), or High Tg FR4 for thermal stress Thickness : 1.6 mm (standard) or 2.0 mm if needed for strength Copper Thickness : 1 oz/ft² (35 µm) standard; 2 oz for higher current paths Surface Finish : ENIG (Electroless Nickel Immersion Gold) for reliability Soldermask Color : Green (standard), or black/blue/red as required Silkscreen : White on component side 7. Wiring NA MIL-grade PTFE (Teflon) insulated wires with crimp/soldered terminals; connected via panel MS/IP67 connectors 8. Protection Measures NA Snubber circuits for relay coilsReverse polarity & ESD protection (TVS Diodes wherever applicable)- Opto-isolators for signal inputs- Series resistors and capacitors for filteringConformal coating Total Quantity : 5
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Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
CompletedBid Opening Date
Technical bids will be opened and evaluated.
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