}
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    • Tender For Fabrication Of Photonic Integrated Circuits For Add-Drop Filters (Detailed Specifications Enclosed As Annexure A, Chandigarh-Chandigarh

    Central Scientific Instruments Organisation has published Tender For Fabrication Of Photonic Integrated Circuits For Add-Drop Filters (Detailed Specifications Enclosed As Annexure A. Submission Date for this Tender is 12-10-2025. Fabrication Work Tenders in Chandigarh Chandigarh. Bidders can get complete Tender details and download the document.




    Tender Notice

    51573442
    Tender For Fabrication Of Photonic Integrated Circuits For Add-Drop Filters (Detailed Specifications Enclosed As Annexure A
    Tender
    Indian
    Chandigarh
    Chandigarh
    12-10-2025

    Tender Details

    Tender For Fabrication Of Photonic Integrated Circuits For Add-Drop Filters (Detailed Specifications Enclosed As Annexure A Minimum dimension of structure ≈100 nm 3. Structure heights 220 nm and 100 nm (location specific) 4. Waveguide width 400-500 nm 5. Overall length of waveguide structures 520 μm 6. SOI wafer specifications Device layer = 220 nm, Buried oxide layer (BOX) = 2μm, Wafer thickness = 725 μm (SOI wafer pieces to be provided by CSIR-CSIO)

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