}

Bids Are Invited For Design Installation And Maintenance Of Educational Lab - Ict Lab; Supply And Installation Of Hardware; Buyer Processors Intel Core I9-13900 (1.5 Ghz E-Core Base Frequency, 2.0 Ghz P-Core Base Frequency, Up To 4.2 Gh Chipset Intel®, Lucknow-Uttar Pradesh

Secretariat Administration Department has published Bids Are Invited For Design Installation And Maintenance Of Educational Lab - Ict Lab; Supply And Installation Of Hardware; Buyer Processors Intel Core I9-13900 (1.5 Ghz E-Core Base Frequency, 2.0 Ghz P-Core Base Frequency, Up To 4.2 Gh Chipset Intel®. Submission Date for this Tender is 19-07-2025. Laboratory Equipment Tenders in Lucknow Uttar Pradesh. Bidders can get complete Tender details and download the document.




Tender Notice

50099033
Bids Are Invited For Design Installation And Maintenance Of Educational Lab - Ict Lab; Supply And Installation Of Hardware; Buyer Processors Intel Core I9-13900 (1.5 Ghz E-Core Base Frequency, 2.0 Ghz P-Core Base Frequency, Up To 4.2 Gh Chipset Intel®
Tender
Indian
Uttar Pradesh
Lucknow
19-07-2025

Tender Documents

Tender Details

Bids Are Invited For Design Installation and Maintenance of Educational Lab - ICT Lab; Supply and Installation of Hardware; Buyer Processors Intel Core i9-13900 (1.5 GHz E-core base frequency, 2.0 GHz P-core base frequency, up to 4.2 GH Chipset Intel® Q670 (vPro*) Form factor All-in-one Maximum memory 64 GB DDR5-5600 SDRAM Transferrates up to 5600 MT/s. Memory slots 2 SODIMM Internal storage 1 TB PCIe NVMe™ TLC M.2 SSD Display 68.6 cm (27) diagonal, QHD (2560 x 1440), touch, IPS, 250 nits, 72% NTSC Graphics NVIDIA GeForce RTX™ 3050 TI (4 GB GDDR5 dedicated Audio Audio by Bang & Olufsen, 5 W stereo speakers, headset and headphone side ports (3.5 mm), high performance integrated stereo speakers Expansion slots 1 M.2 2230; 3 M.2 2280 (1 M.2 2230 slot for WLAN and Bluetooth combo. 3 M.2 2280 for NVMe SSD for storage one attached to CPU PCIe Gen 4.0 and two attached to PCH PCIe Gen 3.0) Ports and connectors Left side: 1 headphone/microphone combo Right side: 1 USB Type-C 20Gbps signaling rate (charging); 1 USB Type-A 10Gbps signaling rate: Rear: 1 USB Type-C 10Gbps signaling rate; 2 USB Type-A 10Gbps signaling rate; 2 USB Type-A 5Gbps signaling rate; 1 HOMI-in 1.4; 1 dual-mode DisplayPort™ 1.4; 1 RJ-45 Communications LAN: Intel I219-LM PCIe® GbE NIC, vPro: Intel Wi-Fi 6E AX211 (2x2) and Bluetooth 5.3 wireless card, vPro* Camera 5 MP Swivel camera with temporal noise reduction and integrated dual array digital microphones Security management Trusted Platform Module TPM 2.0 Embedded Security Chip shipped with Windows 10 (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified Total Quantity :

Key Value

Document Fees
Refer document
EMD
INR 5500.0 /-
Tender Value
INR 11 Lakhs /-

Attachment

FileName File Description File Size
Click here to download tender document Tender Documents 0 KB
Click here to download tender document Tender Documents 0 KB
Click here to download tender document Tender Documents 0 KB
Disclaimer :
We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
Tell us about your Product / Services,
We will Find Tenders for you

Copyright © 2025 · All Rights Reserved. Terms of Usage | Privacy Policy

For Tender Information Services Visit : TenderDetail