}

Bids Are Invited For 51178274 14 Layer-2.33Mm-Foilmethod, Jd3mc Graphics Card Pn: M1020103002, Ms. Micropack , 51178349 14 Layer-1.6Mm-Foilmethod, Jd3mc Iotp2 Card Pn M1020107002 Pkg Micro Pack , 51178478 Pcb, 14 Layer-1.86Mm-Foilmethod, Grade: Mil-P, Rangareddi-Telangana

Department of Defence Production has published Bids Are Invited For 51178274 14 Layer-2.33Mm-Foilmethod, Jd3mc Graphics Card Pn: M1020103002, Ms. Micropack , 51178349 14 Layer-1.6Mm-Foilmethod, Jd3mc Iotp2 Card Pn M1020107002 Pkg Micro Pack , 51178478 Pcb, 14 Layer-1.86Mm-Foilmethod, Grade: Mil-P. Submission Date for this Tender is 27-05-2025. Computer Peripheral Tenders in Rangareddi Telangana. Bidders can get complete Tender details and download the document.




Tender Notice

49094567
Bids Are Invited For 51178274 14 Layer-2.33Mm-Foilmethod, Jd3mc Graphics Card Pn: M1020103002, Ms. Micropack , 51178349 14 Layer-1.6Mm-Foilmethod, Jd3mc Iotp2 Card Pn M1020107002 Pkg Micro Pack , 51178478 Pcb, 14 Layer-1.86Mm-Foilmethod, Grade: Mil-P
Tender
Indian
Telangana
Rangareddi
27-05-2025

Tender Documents

Tender Details

Bids Are Invited For 51178274 14 Layer-2.33Mm-Foilmethod, Jd3mc Graphics Card Pn: M1020103002, Ms. Micropack , 51178349 14 Layer-1.6Mm-Foilmethod, Jd3mc Iotp2 Card Pn M1020107002 Pkg Micro Pack , 51178478 Pcb, 14 Layer-1.86Mm-Foilmethod, Grade: Mil-Prf-55100G, Jd3mc Iotp3 Card, Pn M102010 , 51178610 18 Layer- 2.3M 10% Foilmethod, Jd3mc Carrier Card Pn M1020102003 Pkg Micropack , 51178658 Stroke Card Pcb, 12 Layered Fr4 Pcb, Thickness: 1.93Mm Size: 143.75Mm X 74Mm, P-N: M1020105 , 51178757 Video Card Pcb, M1020104002, 12Layer-2Mm-Foilmethod, P-N M1020104002, Grade: Mil-Prf-55110G (A , 51178120 Jd3mc Asio Card 12 Layers, 2.38Mm 10% Thickness, P-N M1020106000 Rev 00 Micro Pack , 51178151 18-Layer- 4.25Mm-Foilmethod, Jd3mc Vpx Backplane Card. P-N: M1020101000, Mfg: Micropack. , 51178197 12 Layer- 1.6Mm-Foilmethod, Jd3mc Iotp1 Card P-N M1020107001 Rev 00 Pkg Micro Pack , Printed Circuit Board Total Quantity : 401

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