}
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    • Bids Are Invited For Macbook M3 Chip Computing Solution With Unified Memory , Amd Ryzen Processor , 13Th Gen Intel I7 Processor , External Cd Writer , Laptop Stand , Usb Hub Docking Station , High End Laptop - Notebook Total Quantity : 11, Delhi-Delhi

    Indian Army has published Bids Are Invited For Macbook M3 Chip Computing Solution With Unified Memory , Amd Ryzen Processor , 13Th Gen Intel I7 Processor , External Cd Writer , Laptop Stand , Usb Hub Docking Station , High End Laptop - Notebook Total Quantity : 11. Submission Date for this Tender is 13-03-2025.Laptop Tenders in Delhi Delhi. Bidders can get complete Tender details and download the document.




    Tender Notice

    47856789
    Bids Are Invited For Macbook M3 Chip Computing Solution With Unified Memory , Amd Ryzen Processor , 13Th Gen Intel I7 Processor , External Cd Writer , Laptop Stand , Usb Hub Docking Station , High End Laptop - Notebook Total Quantity : 11
    Open Tender
    NCB
    Delhi
    Delhi
    13-03-2025

    Tender Details

    Bids Are Invited For Macbook M3 Chip Computing Solution With Unified Memory , Amd Ryzen Processor , 13Th Gen Intel I7 Processor , External Cd Writer , Laptop Stand , Usb Hub Docking Station , High End Laptop - Notebook Total Quantity : 11

    Key Value

    Document Fees
    Refer document
    EMD
    INR 10000.0 /-
    Tender Value
    INR 5 Lakhs /-
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