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  •   Indian Tenders   › Tender Notice : 46741023

    • Bids Are Invited For Diamond Impregnated Wafering Blades, 5 Inch Outer Dia X 0.015 Inch Kerf Thickness X 0.5 Inch Central , Diamond Impregnated Wafering Blades, 7 Inch Outer Dia X 0.025 Inch Kerf Thickness X 0.5 Inch Central Total Quantity : 16, Hyderabad-Telangana

    Ministry Of Defence has published Bids Are Invited For Diamond Impregnated Wafering Blades, 5 Inch Outer Dia X 0.015 Inch Kerf Thickness X 0.5 Inch Central , Diamond Impregnated Wafering Blades, 7 Inch Outer Dia X 0.025 Inch Kerf Thickness X 0.5 Inch Central Total Quantity : 16. Submission Date for this Tender is 08-01-2025. Diamonds Tenders in Hyderabad Telangana. Bidders can get complete Tender details and download the document.




    Tender Notice

    46741023
    Bids Are Invited For Diamond Impregnated Wafering Blades, 5 Inch Outer Dia X 0.015 Inch Kerf Thickness X 0.5 Inch Central , Diamond Impregnated Wafering Blades, 7 Inch Outer Dia X 0.025 Inch Kerf Thickness X 0.5 Inch Central Total Quantity : 16
    Tender
    Indian
    Telangana
    Hyderabad
    08-01-2025

    Tender Details

    Bids Are Invited For Diamond Impregnated Wafering Blades, 5 Inch Outer Dia X 0.015 Inch Kerf Thickness X 0.5 Inch Central , Diamond Impregnated Wafering Blades, 7 Inch Outer Dia X 0.025 Inch Kerf Thickness X 0.5 Inch Central Total Quantity : 16

    Key Value

    Document Fees
    Refer document
    EMD
    INR 70888.0 /-
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    Tender Value
    Refer document
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