Educational and Research Institute Government Departments Closing in 0 days TDR #46540810

Tender For Supply, Installation Of Microscopic 3D Digital Image Correlation System

Issued by Government Departments · madras, Tamil Nadu
Tender Value
Ref. Documents
Estimated cost
Bid Submission
26 Dec 2024
0 days left
EMD
4.76 Lakhs
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Online

Tender Overview

Competition Type
NCB
Bidding Type
Tender
Location / State
madras → Tamil Nadu
EMD Exemption
Available
Quantity
Not Available

Project Description

Tender For Supply, Installation Of Microscopic 3D Digital Image Correlation System; 1 USB3.0 Camera, 5.0 Mpx, CMOS, 77 fps, Sensor Size: 2/3, C-mount 2 Lens, C-Mount, f=8mm, 5 Mpx, Sensor Size: 2/3, MOD: 100mm 3 Lens, C-Mount, f=50mm, 5 Mpx, Sensor Size: 2/3, MOD: 300mm 4 Laptop PC 5 Docking Station (Laptop PC) 6 DAQ & Triggering Controller 7 USB3 Camera Cable Set 8 LED Illumination System 9 Gimbal Mount (Very High Precision (VHP) Calibration Targets) 10 5 mm Calibration Target (Single-Sided (SS) - Very High Precision (VHP) - Ceramic Target (CE) manufactured via Lithography) 11 10 mm Calibration Target (SS-VHP-CE) 12 15 mm Calibration Target (SS-VHP-CE) 13 Set of 3x Calibration Targets (100/150/200mm) 14 400 mm Calibration Target (Double-Sided (DS) - High-Precision (HP) – Aluminium Honeycomb (AH)) 15 Mounting Rail & Brackets (0.7 m) 16 Standard Tripod 17 Stereoscopic Microscope 18 0.8x planapo chromatic Lens, WD 112 mm 19 Stereoscopic Microscope Horizontal Adapter 20 10x10 cm Thermal Mechanical Hot/Cold Stage with a temperature controller and cooling system. 21 Software Platform (Software platform should provide the underlying, operational functionality for Digital Image Correlation (DIC) and Laser Shearography (LS) measurements in one common, unified, user interface (UI). This should allow the users to utilize DIC or LS technology for optical measurements) 22 Additional Duplicate User Licence 23 Demo Visualization License 24 Camera Acquisition Module(It should allow various camera interface technologies, such as; USB3, GigE, 10GigE, CoaXPress-6/-12, and Firewire cameras, to be operated. It should allow one to three cameras to be activated, configured, manually triggered, and data to be recorded. It should also allow users to perform a calibration of the DIC projected volume and utilize real-time functionalities, such as the pattern quality evaluator) 25 Advanced DAQ Triggering Module (It should allow external & internal triggering and synchronization of various cameras interface technologies, such as: USB3, GigE, 10GigE, CoaXPress-6/-12, and FireWire cameras via the acquisition clock. It should allow to connect the input/output and triggering channels of the DAQ controller) 26 Microscope Calibration Module(It should allow users to calibrate the projection volume using a pseudoscopic imaging model) 27 3D & 2D Correlation Evaluation Module(It should allow acquired raw measurement data series to be correlated & evaluated using the Digital Image Correlation (DIC) technique for the determination of contours, displacements, and strains. Measurement data from one (2D), two (3D) and/or up to three (3D) camera setups can be correlated and evaluated together. The correlation evaluation should include; the selection of correlation type, settings transfer, selection of calibration projection, mask, start-points, gauge objects & coordinate systems) 28 Graphical Visualization Module(It should allow users to picture evaluated measurement results as 2D- overlayered or 3D-images. It should enable the; graphical plotting & smoothing of measurement results, creation of gauge objects, establishing coordinate systems, stencilling data points, and executing application modules. The graphical visualization module gives users the possibility to plot gauged spatial, spectral (FFT) and temporal measurement results with respect to input signals. Users also have the possibility of exporting acquired results in a variety of raw data and movie formats.) 29 Vibration Analysis Package(It should allow users to initiate custom, numerical computations of application data series via integration of DIC software, 4D, and the free and open-source software for numerical computation, SciLabTM through the Open Application Module Interface) 30 Thermal Chip Analysis Package 31 Materials Testing Analysis Package 32 Point Tracking Analysis Package 33 FLC Analysis Package 34 IR Camera Analysis Package 35 Fracture Mechanics Analysis Package 36 ANSYS Workbench Plugin 37 Optional Item 38 SPECIALS-1 IR Camera for IR Camera Analysis in Synchronization

BOQ

Name of Work: Supply, Installation of Microscopic 3D Digital Image Correlation system
Sl. No. Item Description
1USB3.0 Camera, 5.0 Mpx, CMOS, 77 fps, Sensor Size: 2/3\", C-mount
2Lens, C-Mount, f=8mm, 5 Mpx, Sensor Size: 2/3\", MOD: 100mm
3Lens, C-Mount, f=50mm, 5 Mpx, Sensor Size: 2/3\", MOD: 300mm
4Laptop PC
5Docking Station (Laptop PC)
6DAQ & Triggering Controller
7USB3 Camera Cable Set
8LED Illumination System
9Gimbal Mount (Very High Precision (VHP) Calibration Targets)
105 mm Calibration Target (Single-Sided (SS) - Very High Precision (VHP) - Ceramic Target (CE) manufactured via Lithography)
1110 mm Calibration Target (SS-VHP-CE)
1215 mm Calibration Target (SS-VHP-CE)
13Set of 3x Calibration Targets (100/150/200mm)
14400 mm Calibration Target (Double-Sided (DS) - High-Precision (HP) – Aluminium Honeycomb (AH))
15Mounting Rail & Brackets (0.7 m)
16Standard Tripod
17Stereoscopic Microscope
180.8x planapo chromatic Lens, WD 112 mm
19Stereoscopic Microscope Horizontal Adapter
2010x10 cm Thermal Mechanical Hot/Cold Stage with a temperature controller and cooling system.
21Software Platform (Software platform should provide the underlying, operational functionality for Digital Image Correlation (DIC) and Laser Shearography (LS) measurements in one common, unified, user interface (UI). This should allow the users to utilize DIC or LS technology for optical measurements)
22Additional Duplicate User Licence
23Demo Visualization License
24Camera Acquisition Module(It should allow various camera interface technologies, such as; USB3, GigE, 10GigE, CoaXPress-6/-12, and Firewire cameras, to be operated. It should allow one to three cameras to be activated, configured, manually triggered, and data to be recorded. It should also allow users to perform a calibration of the DIC projected volume and utilize real-time functionalities, such as the pattern quality evaluator)
25Advanced DAQ Triggering Module (It should allow external & internal triggering and synchronization of various cameras interface technologies, such as: USB3, GigE, 10GigE, CoaXPress-6/-12, and FireWire cameras via the acquisition clock. It should allow to connect the input/output and triggering channels of the DAQ controller)
26Microscope Calibration Module(It should allow users to calibrate the projection volume using a pseudoscopic imaging model)
273D & 2D Correlation Evaluation Module(It should allow acquired raw measurement data series to be correlated & evaluated using the Digital Image Correlation (DIC) technique for the determination of contours, displacements, and strains. Measurement data from one (2D), two (3D) and/or up to three (3D) camera setups can be correlated and evaluated together. The correlation evaluation should include; the selection of correlation type, settings transfer, selection of calibration projection, mask, start-points, gauge objects & coordinate systems)
28Graphical Visualization Module(It should allow users to picture evaluated measurement results as 2D- overlayered or 3D-images. It should enable the; graphical plotting & smoothing of measurement results, creation of gauge objects, establishing coordinate systems, stencilling data points, and executing application modules. The graphical visualization module gives users the possibility to plot gauged spatial, spectral (FFT) and temporal measurement results with respect to input signals. Users also have the possibility of exporting acquired results in a variety of raw data and movie formats.)
29Vibration Analysis Package(It should allow users to initiate custom, numerical computations of application data series via integration of DIC software, 4D, and the free and open-source software for numerical computation, SciLabTM through the Open Application Module Interface)
30Thermal Chip Analysis Package
31Materials Testing Analysis Package
32Point Tracking Analysis Package
33FLC Analysis Package
34IR Camera Analysis Package
35Fracture Mechanics Analysis Package
36ANSYS Workbench Plugin
37Optional Item
38SPECIALS-1 IR Camera for IR Camera Analysis in Synchronization

AI Tender Summary

OUR REF NO 46540810
AUTHORITY Government Departments
TENDER VALUE Ref. Documents
LAST DATE 26-12-2024
Authority
Authority Name Indian Institute Of Technology
Work Description Tender For Supply, Installation Of Microscopic 3D Digital Image Correlation System; 1 USB3.0 Camera, 5.0 Mpx, CMOS, 77 fps, Sensor Size: 2/3, C-mount 2 Lens, C-Mount, f=8mm, 5 Mpx, Sensor Size: 2/3, MOD: 100mm 3 Lens, C-Mount, f=50mm, 5 Mpx, Sensor Size: 2/3, MOD: 300mm 4 Laptop PC 5 Docking Station (Laptop PC) 6 DAQ & Triggering Controller 7 USB3 Camera Cable Set 8 LED Illumination System 9 Gimbal Mount (Very High Precision (VHP) Calibration Targets) 10 5 mm Calibration Target (Single-Sided (SS) - Very High Precision (VHP) - Ceramic Target (CE) manufactured via Lithography) 11 10 mm Calibration Target (SS-VHP-CE) 12 15 mm Calibration Target (SS-VHP-CE) 13 Set of 3x Calibration Targets (100/150/200mm) 14 400 mm Calibration Target (Double-Sided (DS) - High-Precision (HP) – Aluminium Honeycomb (AH)) 15 Mounting Rail & Brackets (0.7 m) 16 Standard Tripod 17 Stereoscopic Microscope 18 0.8x planapo chromatic Lens, WD 112 mm 19 Stereoscopic Microscope Horizontal Adapter 20 10x10 cm Thermal Mechanical Hot/Cold Stage with a temperature controller and cooling system. 21 Software Platform (Software platform should provide the underlying, operational functionality for Digital Image Correlation (DIC) and Laser Shearography (LS) measurements in one common, unified, user interface (UI). This should allow the users to utilize DIC or LS technology for optical measurements) 22 Additional Duplicate User Licence 23 Demo Visualization License 24 Camera Acquisition Module(It should allow various camera interface technologies, such as; USB3, GigE, 10GigE, CoaXPress-6/-12, and Firewire cameras, to be operated. It should allow one to three cameras to be activated, configured, manually triggered, and data to be recorded. It should also allow users to perform a calibration of the DIC projected volume and utilize real-time functionalities, such as the pattern quality evaluator) 25 Advanced DAQ Triggering Module (It should allow external & internal triggering and synchronization of various cameras interface technologies, such as: USB3, GigE, 10GigE, CoaXPress-6/-12, and FireWire cameras via the acquisition clock. It should allow to connect the input/output and triggering channels of the DAQ controller) 26 Microscope Calibration Module(It should allow users to calibrate the projection volume using a pseudoscopic imaging model) 27 3D & 2D Correlation Evaluation Module(It should allow acquired raw measurement data series to be correlated & evaluated using the Digital Image Correlation (DIC) technique for the determination of contours, displacements, and strains. Measurement data from one (2D), two (3D) and/or up to three (3D) camera setups can be correlated and evaluated together. The correlation evaluation should include; the selection of correlation type, settings transfer, selection of calibration projection, mask, start-points, gauge objects & coordinate systems) 28 Graphical Visualization Module(It should allow users to picture evaluated measurement results as 2D- overlayered or 3D-images. It should enable the; graphical plotting & smoothing of measurement results, creation of gauge objects, establishing coordinate systems, stencilling data points, and executing application modules. The graphical visualization module gives users the possibility to plot gauged spatial, spectral (FFT) and temporal measurement results with respect to input signals. Users also have the possibility of exporting acquired results in a variety of raw data and movie formats.) 29 Vibration Analysis Package(It should allow users to initiate custom, numerical computations of application data series via integration of DIC software, 4D, and the free and open-source software for numerical computation, SciLabTM through the Open Application Module Interface) 30 Thermal Chip Analysis Package 31 Materials Testing Analysis Package 32 Point Tracking Analysis Package 33 FLC Analysis Package 34 IR Camera Analysis Package 35 Fracture Mechanics Analysis Package 36 ANSYS Workbench Plugin 37 Optional Item 38 SPECIALS-1 IR Camera for IR Camera Analysis in Synchronization
Basic Detail
Tender No IITM/SPS/ DIC/0021/2024-25/SPL
Bidding Type Tender
Location
City madras
State Tamil Nadu
Key Dates
Publish Date 05 Dec 2024
Submission Date 26 Dec 2024
Open Date 27 Dec 2024
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD 4.76 Lakhs
Exemption Available
Document List
8e544e2b-e324-4e91-9ace-0626ac1b29d4.html
BOQ_241800.xls
Tendernotice_1.pdf

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Tender Timeline

Dec 05, 2024
11:30 IST

Tender Published

Tender notice published.

Completed
Dec 26, 2024
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Completed
Dec 27, 2024

Bid Opening Date

Technical bids will be opened and evaluated.

Completed

Tender Documents

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html

8e544e2b-e324-4e91-9ace-0626ac1b29d4.html

xls

BOQ_241800.xls

pdf

Tendernotice_1.pdf

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