Educational and Research Institute Government Departments Closing in 0 days TDR #45657460

Tender For Atomic Layer Deposition System

Issued by Government Departments · Mumbai Suburban, Maharashtra
Tender Value
Ref. Documents
Estimated cost
Bid Submission
24 Oct 2024
0 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Online

Tender Overview

Competition Type
NCB
Bidding Type
Tender
Location / State
Mumbai Suburban → Maharashtra
EMD Exemption
Not Available
Quantity
Not Available

Project Description

Tender For Atomic Layer Deposition System; Item 1 Atomic Layer Deposition system (Qty -1) 1 Technical Specifications: - 1.a. Heated chamber isolation valve for high exposure, high conformality processes 1.b. Dedicated process kit with optimized precursor flow path and all metal sealing upstream of sample 1.c. Precursor input: 1 process gas & 1 high vapor pressure liquid oxidant (H2O or H2O2) 1.d. 3 solid or liquid metal sources 1.e. All sources include heated, integrated dose volumes for precise and quantifiable precursor delivery 1.f. 4 Swagelok or substantially equivalent thermal ALD valves 1.g. 5 high temperature dose volume fill valves 1.h. Fujikin or substantially equivalent metal sealed, 200 sccm MFC for N2 or Ar purge flow control 1.i. Fully automated temperature control system for bottles, dose volumes, precursor delivery manifold and chamber 1.j. Chamber heater control based on dual temperature probes for accuracy and as probe failure failsafe 1.k. Color touchscreen control and PLC operation 1.l. Software embedded in PLC with integrated process recipes 1.m. 36-month complete process development support and lifetime process development assistance. 2 Separate Precursor Lines All organometallic sources must pass through a path within the gas distribution manifold separate from oxidants and reductants to minimize chemical cross talk or cross-contamination during deposition processes 2.b. Defined Dose Volume Pulsing (DDVP): The dose of each precursor into the deposition chamber is determined by the precursor temperature and a fixed volume between the precursor valve and the dose valve for each source. 2.c. All Source Lines must be electropolished stainless steel tubes with metal sealed VCR fittings 3 Software and Electronics .3.a. Human Machine Interface (HMI) PLC system with touch screen panel 3.b. Advanced controls suitable for the deposition of standard ALD cycles as well as e.g. Nanolaminates, Doped Thin Films and Ternary Thin Films. 3.c. Recipe database for high quality, tested processes 3.d. Custom recipe input screen 3.e. Real time display of process status 3.f. Individually programmable heated source temperatures 3.g Built-in pulsing sequences for ternary compounds and nanolaminates 4 Safety 4.a. Vacuum switch and separate capacitance manometer pressure measurement to ensure system is under vacuum during processing 4.b. Hardware interlock for overheating 4.c. Bottle overheat software interlocks 4.d. Physical emergency off (EMO) button on front panel 4.e. Normally closed pneumatic valves (all valves will be closed in the event of a system failure or EMO). 4.f. All exterior surfaces are touch safe 5 Mandatory Requirements 5.a. Vendor to have multiple systems operating in internationally renowned institutes or universities,.e.g. Harvard University Centre for Nanoscale Systems, University of Cambridge Cavendish Laboratory etc. 6 Other Requirements 6.a. Process qualification 6.a.i Over the entire wafer deposition of pinhole free 2nm Al2O3 for GaN/SiC wafers. surface roughness should be less than 0.2 nm or the substrate roughness whichever is larger. The process will be repeated 3 times for a 4-inch substrate. This should be RMS roughness determined over 50 um x 50 um area via AFM. 6.b. Installation needed, with Operational and installation manual 6.c. Needed Tool Kit for ALD system 6.d. Warranty: Standard 1-year manufacturer’s warranty required Item 2 Precursor Bottles (Qty -1) a. 50cc SS bottle with bellows sealed high temperature compatible valve b. 50cc SS bottle for H20 with valve Item 3 Pump Oil (Qty -1) a. Fomblin or substantially equivalent Pumping Fluid 2 kg Item 4 Heating Jacket (Qty -1) a. One Conformal Heating Jacket with secondary elbow heater for operation to 150DegC Item 5 Vacuum Pump (Qty -1) a. Mechanical Direct Drive Pump for PFPE oil 17 CFM (pumping speed) 50Hz 2 Stage, Single Phase 0.75 HP, 37 kg Fomblin or substantially equivalent included OR b. Direct Drive Rotary Vane Vacuum Pump for PFPE oil 18.3 CFM (pumping speed) 50Hz 0.7 HP, 37 kg Fomblin or substantially equivalent included Item 6 POSI-TRAP with NW-40 ports (Qty -1) a. Activated charcoal filter installed for precursor abatement b. 3ft NW25 SS bellows hose to connect vac inlet to ALD system

Corrigendum

Sr No Corrigendum Date Corrigendum Type New Submission Date
1 15-Oct-2024 Due date extended for 10 days Date 24-Oct-2024

AI Tender Summary

OUR REF NO 45657460
AUTHORITY Government Departments
TENDER VALUE Ref. Documents
LAST DATE 24-10-2024
Authority
Authority Name Indian Institute Of Technology
Work Description Tender For Atomic Layer Deposition System; Item 1 Atomic Layer Deposition system (Qty -1) 1 Technical Specifications: - 1.a. Heated chamber isolation valve for high exposure, high conformality processes 1.b. Dedicated process kit with optimized precursor flow path and all metal sealing upstream of sample 1.c. Precursor input: 1 process gas & 1 high vapor pressure liquid oxidant (H2O or H2O2) 1.d. 3 solid or liquid metal sources 1.e. All sources include heated, integrated dose volumes for precise and quantifiable precursor delivery 1.f. 4 Swagelok or substantially equivalent thermal ALD valves 1.g. 5 high temperature dose volume fill valves 1.h. Fujikin or substantially equivalent metal sealed, 200 sccm MFC for N2 or Ar purge flow control 1.i. Fully automated temperature control system for bottles, dose volumes, precursor delivery manifold and chamber 1.j. Chamber heater control based on dual temperature probes for accuracy and as probe failure failsafe 1.k. Color touchscreen control and PLC operation 1.l. Software embedded in PLC with integrated process recipes 1.m. 36-month complete process development support and lifetime process development assistance. 2 Separate Precursor Lines All organometallic sources must pass through a path within the gas distribution manifold separate from oxidants and reductants to minimize chemical cross talk or cross-contamination during deposition processes 2.b. Defined Dose Volume Pulsing (DDVP): The dose of each precursor into the deposition chamber is determined by the precursor temperature and a fixed volume between the precursor valve and the dose valve for each source. 2.c. All Source Lines must be electropolished stainless steel tubes with metal sealed VCR fittings 3 Software and Electronics .3.a. Human Machine Interface (HMI) PLC system with touch screen panel 3.b. Advanced controls suitable for the deposition of standard ALD cycles as well as e.g. Nanolaminates, Doped Thin Films and Ternary Thin Films. 3.c. Recipe database for high quality, tested processes 3.d. Custom recipe input screen 3.e. Real time display of process status 3.f. Individually programmable heated source temperatures 3.g Built-in pulsing sequences for ternary compounds and nanolaminates 4 Safety 4.a. Vacuum switch and separate capacitance manometer pressure measurement to ensure system is under vacuum during processing 4.b. Hardware interlock for overheating 4.c. Bottle overheat software interlocks 4.d. Physical emergency off (EMO) button on front panel 4.e. Normally closed pneumatic valves (all valves will be closed in the event of a system failure or EMO). 4.f. All exterior surfaces are touch safe 5 Mandatory Requirements 5.a. Vendor to have multiple systems operating in internationally renowned institutes or universities,.e.g. Harvard University Centre for Nanoscale Systems, University of Cambridge Cavendish Laboratory etc. 6 Other Requirements 6.a. Process qualification 6.a.i Over the entire wafer deposition of pinhole free 2nm Al2O3 for GaN/SiC wafers. surface roughness should be less than 0.2 nm or the substrate roughness whichever is larger. The process will be repeated 3 times for a 4-inch substrate. This should be RMS roughness determined over 50 um x 50 um area via AFM. 6.b. Installation needed, with Operational and installation manual 6.c. Needed Tool Kit for ALD system 6.d. Warranty: Standard 1-year manufacturer’s warranty required Item 2 Precursor Bottles (Qty -1) a. 50cc SS bottle with bellows sealed high temperature compatible valve b. 50cc SS bottle for H20 with valve Item 3 Pump Oil (Qty -1) a. Fomblin or substantially equivalent Pumping Fluid 2 kg Item 4 Heating Jacket (Qty -1) a. One Conformal Heating Jacket with secondary elbow heater for operation to 150DegC Item 5 Vacuum Pump (Qty -1) a. Mechanical Direct Drive Pump for PFPE oil 17 CFM (pumping speed) 50Hz 2 Stage, Single Phase 0.75 HP, 37 kg Fomblin or substantially equivalent included OR b. Direct Drive Rotary Vane Vacuum Pump for PFPE oil 18.3 CFM (pumping speed) 50Hz 0.7 HP, 37 kg Fomblin or substantially equivalent included Item 6 POSI-TRAP with NW-40 ports (Qty -1) a. Activated charcoal filter installed for precursor abatement b. 3ft NW25 SS bellows hose to connect vac inlet to ALD system
Basic Detail
Tender No 6100001885
Bidding Type Tender
Location
City Mumbai Suburban
State Maharashtra
Key Dates
Publish Date 15 Oct 2024
Submission Date 24 Oct 2024
Open Date 24 Oct 2024
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Not Available
Document List
71e420fc-1af0-4771-9da0-031746f5153d.html
NIT 6100001885.pdf
Tech Specs updated.pdf
Tendernotice_1.pdf
Tendernotice_2.pdf

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Tender Timeline

Oct 15, 2024
11:30 IST

Tender Published

Tender notice published.

Completed
Oct 24, 2024
18:00 IST

Corrigendum-1 Issued

Clarifications on tender conditions and amendments issued.

Completed
Oct 24, 2024
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Completed
Oct 24, 2024

Bid Opening Date

Technical bids will be opened and evaluated.

Completed

Tender Documents

Download All (ZIP) ↓
html

71e420fc-1af0-4771-9da0-031746f5153d.html

pdf

NIT 6100001885.pdf

pdf

Tech Specs updated.pdf

pdf

Tendernotice_1.pdf

pdf

Tendernotice_2.pdf

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