Tender For Purchase Of Equipments For Mech.(Cad) Dept., Coordinate Measurement Machine (Cmm)
Tender Overview
Project Description
Purchase Of Equipments For Mech.(Cad) Dept., Coordinate Measurement Machine (Cmm) , Coordinatemeasurement Machine (Cmm) , Technical Specifications : Measuring Range(X/Y/Z) 300X200x200mm Platform Load Capacity60 Kg Probe Head Renishaw’S Mcp Operation Mode Manual Power Supply 220V ± 5% @ 50/60Hz Resolution0.001Mm Accuracy (X/Y)(3+L/200) ?M Mpe U3 6+L/100 ?M Repeatability ±2 ?M (By Ring Gauge (0.003Mm)) Transmissionlinear Guide Way + Drive Nut Software3d Measuring Software (Sipmeas) Hardwarepc+19’ Tft Monitor Base Platform High Precision Granite Dn 876 Grade 0 Touch Proberenishawmcpwith Stylus And Calibration Ball Z-Axis Balancecounter Weight Renishaw Mcp Probe Small, Light And Versatile Probe Excellent Repeatability 5 Way Measuring Capability Stylus Overtravel Xy2200 Stylus Overtravel 5.5Mm @ 0.11N And 2Mm @ 0.3N Max Mean Repeatability 2 0.35?M Stylus Force Range 0.11N-0.3 N Long Stylus Carrying Capability With Standard Accessories
BOQ
| Sl. No. | Item Description |
| 1 | COORDINATEMEASUREMENT MACHINE (CMM) |
| 2 | TECHNICAL SPECIFICATIONS : Measuring Range(X/Y/Z) 300x200x200mmPlatform Load Capacity60 kgProbe Head Renishaw’s MCPOperation Mode Manual Power Supply 220V ± 5% @ 50/60HZResolution0.001mmAccuracy (X/Y)(3+L/200) µmMPE U3 6+L/100 µm Repeatability ±2 µm (By Ring Gauge (0.003mm))TransmissionLinear Guide Way + Drive nutSoftware3D Measuring Software (SIPMEAS)HardwarePC+19’ TFT MonitorBase Platform High Precision Granite DN 876Grade 0Touch ProbeRenishawMCPwith Stylus andCalibration Ball Z-Axis BalanceCounter weightRenishaw MCP ProbeSmall, Light and versatile probeExcellent repeatability5 way measuring capabilityStylus overtravel XY2200Stylus overtravel 5.5mm @ 0.11N and 2mm @ 0.3NMax mean repeatability 2 0.35µmStylus force range 0.11N-0.3 NLong stylus carrying capabilityWith standard accessories |
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Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
CompletedBid Opening Date
Technical bids will be opened and evaluated.
CompletedTender Documents
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