Tender For Equipments

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Tender For Equipments; 1. Metal Organic Chemical Vapor Deposition (MOCVD) reactor Wafer Size: 6” Number of wafer to be loaded: 8 Materials to be grown – GaN, in GaN, AlN, AlGaN Substrates: Sapphire, GaN, Si System is required for growth of LED structures for fabrication of micro-LEDs. 2. Gas Cabinets Gas cabinet system for the following gases: NH3, Silane, Arsine, Phosphine, Cl2, BCl3, CF4, SF6 etc. System is required for holding different gas cylinders with auto shut-off option if gas leak is detected. 3. Detector/ sensors Gas Detectors for sensing of following NH3, Silane, Arsine, Phosphine, chlorine, H2, O2, CF4, etc. System is required for detection of toxic poisonous gas leakages. 4. Gas Scrubbers Wet and dry scrubbers for neutralization of toxic gas from MOCVD, PECVD etc. System is required for dilution of toxic gases such as Cl2, BCl3 etc. 5 Chiller 20 KW For the cooling of MOCVD reactor during growth process. 6. H2 Purifiers Generator Hydrogen purifier or generator for generating 99.9999% hydrogen gas High purity hydrogen is required for the growth of high quality epitaxial layers. 7. PL Mapping System (cassette) PL mapping system for wafer mapping of AlN, GaN, inGaN and GaAs, lnP, Si and GaN & GaAs based LED structures Wafer Size: 6 inch. PL mapping system is required for the mapping of epitaxially grown LED/laser structures. 8. Ion implanter Implantation of B, P, Mg, Mg++, N2, Si, Ni, Sn, Ge, Be, Mn etc. System will be used for doping of different impurities in different semiconductor material/ devices. 9. Stealth Laser Dicing For dicing of GaN, sapphire, silicon and diamond wafers. System will be used for the dicing of wafers/ chip separation of semiconductor devices. 10. X Ray inspection System For fault analysis of devices The system will be used for finding of cracks semiconductor devices such as MEMS based sensors. 11. Auto Flip-chip probing and testing system Electro-optical testing/ characterization of micro-LEDs with minimum pad size (n &p) of 6 microns Wafer size: 2-6 inch Micro-LEDs chip Size: 20 micron x 20 micron Emission colors/ wavelength: Blue, Green, Red. For testing/ Characterization of micro-LEDs (flip chip)