Tender For Kcu_To_Pad_Layer Interface Board
Tender Overview
Project Description
Tender For Kcu_To_Pad_Layer Interface Board, Kcu_To_Pad_Layer Interface Board (As Per Technical Specification)
Corrigendum
| Sr No | Corrigendum Date | Corrigendum | Type | New Submission Date |
|---|---|---|---|---|
| 1 | 12-Aug-2024 | Bid Auto Extn Corrigendum | Bid Auto Extn Corrigendum | 19-Aug-2024 |
| 2 | 19-Aug-2024 | Corrigendum-02 | Date | 26-Aug-2024 |
| 3 | 26-Aug-2024 | Corrigendum-03 | Date | 02-Sep-2024 |
BOQ
| Sl. No. | Item Description |
| 1 | KCU_TO_PAD_LAYER INTERFACE BOARD(As per Technical Specification) |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedCorrigendum-1 Issued
Clarifications on tender conditions and amendments issued.
CompletedCorrigendum-2 Issued
Clarifications on tender conditions and amendments issued.
CompletedCorrigendum-3 Issued
Clarifications on tender conditions and amendments issued.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
CompletedBid Opening Date
Technical bids will be opened and evaluated.
CompletedTender Documents
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