}

Bids Are Invited For Dclc Solutions For Hpc Cluster Cdac Bangalore Cooling Distribution Unit Stand Alone With Primary And Secondary Connection Kit, Hose, Flange Etc. , Under Floor Piping Ss Work And Connection To Cdus And Manifolds Along With Grooved, Pune-Maharashtra

Department Of Electronics And Information Technology has published Bids Are Invited For Dclc Solutions For Hpc Cluster Cdac Bangalore Cooling Distribution Unit Stand Alone With Primary And Secondary Connection Kit, Hose, Flange Etc. , Under Floor Piping Ss Work And Connection To Cdus And Manifolds Along With Grooved. Submission Date for this Tender is 07-08-2024. Personal Computers Tenders in Pune Maharashtra. Bidders can get complete Tender details and download the document.




Tender Notice

43649110
Corrigendum : Bids Are Invited For Dclc Solutions For Hpc Cluster Cdac Bangalore Cooling Distribution Unit Stand Alone With Primary And Secondary Connection Kit, Hose, Flange Etc. , Under Floor Piping Ss Work And Connection To Cdus And Manifolds Along With Grooved
Tender
Indian
Maharashtra
Pune
07-08-2024

Tender Details

Bids Are Invited For Dclc Solutions For Hpc Cluster Cdac Bangalore Cooling Distribution Unit Stand Alone With Primary And Secondary Connection Kit, Hose, Flange Etc. , Under Floor Piping Ss Work And Connection To Cdus And Manifolds Along With Grooved Fittings, Supply And Return Valve Train, All Types Of Valves, Flow Control Devices, Breaded Hose Etc. , Supply And Return Manifold , Cold Plate Pair Suitable For 2 X Intel Cascade Lake Processor 6240R Along With Tube Of Appropriate Length With Quick Disconnect Dripless Connectors , Coolant For Secondary Network , Any Other Items -Components Required To Complete The Scope , Any Other Charges Required To Complete The Dclc Solutions In Total. , Charges Towards - Installation, Commissioning, Testing Etc. Total Quantity : 3619

Corrigendum Details

Sr No CorrigendumDate Corrigendum CorrigendumType NewSubmissionDate
1 12-07-2024 25-07-2024
2 23-07-2024 01-08-2024
3 31-07-2024 07-08-2024

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