Tender For Gold Sputtering Target Etc.,
Tender Overview
Project Description
Gold Sputtering Target Etc., , Gold (Au) Sputtering Target Purity: 99.99% (Test Report To Be Provided And The Same Will Be Verified At Nal) Dimension: 3 Inch Dia (76.2 Mm) X 3Mm Bonding: Indium Baking Plate: Copper (Cu) (3Mm Thick) , Sub-Total:Ex-Works Price , Less: Discount (If Any) , Sub-Total: , Installation & Commissioning Charges (If Any) , Training Charges (If Any) , Any Other Charges, If Any
BOQ
| Sl. No. | Item Description |
| 1 | Gold (Au) Sputtering Target Purity: 99.99% (Test report to be provided and the same will be verified at NAL)Dimension: 3 inch dia (76.2 mm) x 3mm Bonding: Indium BakingPlate: Copper (Cu) (3mm thick) |
| 2 | Sub-Total:Ex-Works Price |
| 3 | Less: Discount (if any) |
| 4 | Sub-Total: |
| 5 | Installation & Commissioning charges (if any) |
| 6 | Training charges (if any) |
| 7 | Any other charges, if any |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
CompletedBid Opening Date
Technical bids will be opened and evaluated.
CompletedTender Documents
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