Ministry Of Defence-MOD has published Bids Are Invited For Diamond Impregnated Wafering Blade 5 Inch Outer Dia X 0.015 Inch Thickness X 0.5 Inch Central Hole (Q3) , Diamond Impregnated Wafering Blades 6 Inch Outer Dia X 0.020 Inch Thickness X 0.5 Inch Central Hole (Q3) , Diamond Impregna. Submission Date for this Tender is 28-03-2024. Diamonds Tenders in Hyderabad Telangana. Bidders can get complete Tender details and download the document.
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