Defence Statutory Bodies & Commissions/Committees Closing in 0 days TDR #42480167

Bids Are Invited For P/N. Hal2034140075-28, Dis. Rtv 3140 Clear (Dow Corning) , Pack Size: 1 Pack Of 90 Gms (Q3) , P/N. Hal2034140082-07, Dis. Silicon Rubber Sealant Rtv 3145, Clear/Grey Pack Size: 1 Pack Of 90 Gms (Q3) , P/N. 191660651, Dis. P. Therm

Issued by Statutory Bodies & Commissions/Committees · SULTANPUR, Uttar Pradesh
Tender Value
Ref. Documents
Estimated cost
Bid Submission
16 Mar 2024
0 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Organization
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Tender ID
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Competition Type
NCB
Bidding Type
Tender
Location / State
SULTANPUR → Uttar Pradesh
EMD Exemption
Not Available
Quantity
Not Available
Website
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Contact Person
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Address
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Project Description

Bids Are Invited For P / N. Hal2034140075-28, Dis. Rtv 3140 Clear ( Dow Corning ) , Pack Size: 1 Pack Of 90 Gms ( Q3 ) , P / N. Hal2034140082-07, Dis. Silicon Rubber Sealant Rtv 3145, Clear / Grey Pack Size: 1 Pack Of 90 Gms ( Q3 ) , P / N. 191660651, Dis. P. Thermal Conductrice Oxime Rtv, Tcor75sseringue75ml, Electrolube. P / S: 1Pack Of90gms ( Q3 ) , P / N. 191660651, Dis. Paste Thermal Conductrice Oxime Rtv, Tcor75s Seringue75ml, Electrolube. P / S: 1P. Of75ml ( Q3 ) , P / N. 185001971, Dis. Silicone Rtv Incolore Eq: 15120430-6, Tse-392-C Tube 100G, 3M. P. Si: 1Pack Of100ml ( Q3 ) , P / N. 185001971, Dis. Silicone Rtv Incolore Eq: 15120430-6, Tse-392-C Tube 100G, 3M. Pac. Si: 1Pack Of100ml ( Q3 ) , P / N. 1178- 0106-10, Dis. Sili, Rub. Kit, Silasticjrtvkit, 2Parts-Kit* Base-Colo. Bei. , Cur. A-G, P. S1kitof1100gms ( Q3 ) , P / N. 1178-0106-10, Dis. Sili. , Rub. Kit, Silastic Jrtv Kit, 2P. - Kit* Base-Colour B. Cu. A-G, P. S: 1Kitof1100gms ( Q3 ) , P / N. 1183-0101-00, Di. Si. Ad. / S. , Ele72- 00002Con / Rtvag1pa. P. E. S: Sd1183-0101-00Te. P / N: Co / Rt, Ps: 1Tu56.7Gms ( Q3 ) , P / N. 1183-0101-00, D. S. A / Se72-00002C / Rag1ppes: Sd1183-0101-00T. P / N: C / R= I72-00002Rsas1tub56.7Gms ( Q3 ) , P / N. 1183-0162-00, Di. Adhesive, Silicone Adhesive / Sealant Ele72- 000035Con-- / Rtv Nickelp / S: 1Kitof454gms ( Q3 ) , 162-00. Sealant Ele 72-000035 Con- / Rtv Nickel. P / S. 1 Kit Of 454 Gms. Or Chobond 1075, P / S: 2.5Oz / Kit ( Q3 ) , P / N. Hal2032390040-08, Dis. Adhesive Epoxy, Tra-Bond-Bb- 2112, Pack Size: 1 Pack Of 7.8 Gms ( Q3 ) , P / N. Cho-Bond- 50-02-1030-0000, Dis. Chobond Adhesive1030, For Oring With Primer1086 P / S: 1Kit Of113.4Ml ( Q3 ) , P / N. Cho-Bond-50-02-1030-0000, Dischobond Adhesive1030, For O-Ring With Primer1086 P / S: 1Kit Of113.4Ml ( Q3 ) , P / N. 15122013-6, Dis. Glue Cyanolite Type 201, Pack Size: 1 Pack Of 2 Gms ( Q3 ) , P / N. 15120258-4, Dis. Glue Eccobond 104 ( A+ B ) , Emerson & Cuming Or Henkal Pack Size: 1 Kit Of 500 Gms ( Q3 ) , P / N. 1754-631, Dis. Tensol Cement No. 70, Ici. , Pack Size: 1 Pack Of 225 Ml ( Q3 ) , P / N. 15120230-2, Dis. E-Solder 3021 Glue, A+ B ( Silver-Conductive-Adhesive ) P / Siz: 1 Kit Of 2.2566 Kg ( Q3 ) , P / N. 15120230-2, Dis. E-Solder 3021 Glue, A+ B ( Silver-Conductive-Adhesive ) Pack Size: 1Kit Of2.2566Kg ( Q3 ) , P / N. Hal2908090000-16, Dis. Solder Paste, Ncsmq92h Pack Size: 1 Pkt Of 500 Gms ( Q3 ) , P / N. Hal2908090015-68, Dis. Solder Flux Gel No Clean, Pack Size: 1 Pack Of 10 Gms ( Q3 ) , P / N. Hal2032040010-82, Dis. Adhesive Bostik 1782, Pack Size: 1 Pack Of 1000 Gms ( Q3 ) , P / N. 01752-00297, Dis. Primer, Silcoset 105 With Curing Agent A Pack Size: 1 Kit Of 1010 Gms ( Q3 ) , P / N. Hal2305810010-34, Dis. Primer For Silicon Rubber, Clear, Dc Pack Size: 1 Pack Of 500 Ml ( Q3 ) , P / N. 15410060-4, Dis. Primer Ref. 1201, Pack Size: 1 Pack Of 348 Ml ( Q3 ) , Hal2309500430-63, Dis. Adhesive Pressure Sensitive, 9469-3M, 0.01 Thick, 6.0 Wide. P / S: 1 Roll Of 1 Roll ( Q3 ) , P / N. Hal2309500430-63, Dis. Adhesive Pressure Sensitive, 9469-3M, 0.01 Thick, 6.0 Wide. P / S: 1Roll Of 1 Rol ( Q3 ) , P / N. 15160084-7, Dis. Lubricant Molykote Aerosol 400Ml, Pack Size: 1 Pack Of 0.3 Kg ( Q3 ) , P / N. 15160084-7, Dis. Lubricant Molykote Aerosol 400Ml. Pack Size: 1 Pack Of 0.3 Kg ( Q3 ) , P / N. 1176-0010-44, Dis. Temporary Solder Mask, 8 Oz. Bottle-1030 Pack Size: 1 Pack Of 237 Ml ( Q3 ) Total Quantity : 692

AI Tender Summary

OUR REF NO 42480167
AUTHORITY Statutory Bodies & Commissions/Committees
TENDER VALUE Ref. Documents
LAST DATE 16-03-2024
Authority
Authority Name Department of Defence Production
Work Description Bids Are Invited For P / N. Hal2034140075-28, Dis. Rtv 3140 Clear ( Dow Corning ) , Pack Size: 1 Pack Of 90 Gms ( Q3 ) , P / N. Hal2034140082-07, Dis. Silicon Rubber Sealant Rtv 3145, Clear / Grey Pack Size: 1 Pack Of 90 Gms ( Q3 ) , P / N. 191660651, Dis. P. Thermal Conductrice Oxime Rtv, Tcor75sseringue75ml, Electrolube. P / S: 1Pack Of90gms ( Q3 ) , P / N. 191660651, Dis. Paste Thermal Conductrice Oxime Rtv, Tcor75s Seringue75ml, Electrolube. P / S: 1P. Of75ml ( Q3 ) , P / N. 185001971, Dis. Silicone Rtv Incolore Eq: 15120430-6, Tse-392-C Tube 100G, 3M. P. Si: 1Pack Of100ml ( Q3 ) , P / N. 185001971, Dis. Silicone Rtv Incolore Eq: 15120430-6, Tse-392-C Tube 100G, 3M. Pac. Si: 1Pack Of100ml ( Q3 ) , P / N. 1178- 0106-10, Dis. Sili, Rub. Kit, Silasticjrtvkit, 2Parts-Kit* Base-Colo. Bei. , Cur. A-G, P. S1kitof1100gms ( Q3 ) , P / N. 1178-0106-10, Dis. Sili. , Rub. Kit, Silastic Jrtv Kit, 2P. - Kit* Base-Colour B. Cu. A-G, P. S: 1Kitof1100gms ( Q3 ) , P / N. 1183-0101-00, Di. Si. Ad. / S. , Ele72- 00002Con / Rtvag1pa. P. E. S: Sd1183-0101-00Te. P / N: Co / Rt, Ps: 1Tu56.7Gms ( Q3 ) , P / N. 1183-0101-00, D. S. A / Se72-00002C / Rag1ppes: Sd1183-0101-00T. P / N: C / R= I72-00002Rsas1tub56.7Gms ( Q3 ) , P / N. 1183-0162-00, Di. Adhesive, Silicone Adhesive / Sealant Ele72- 000035Con-- / Rtv Nickelp / S: 1Kitof454gms ( Q3 ) , 162-00. Sealant Ele 72-000035 Con- / Rtv Nickel. P / S. 1 Kit Of 454 Gms. Or Chobond 1075, P / S: 2.5Oz / Kit ( Q3 ) , P / N. Hal2032390040-08, Dis. Adhesive Epoxy, Tra-Bond-Bb- 2112, Pack Size: 1 Pack Of 7.8 Gms ( Q3 ) , P / N. Cho-Bond- 50-02-1030-0000, Dis. Chobond Adhesive1030, For Oring With Primer1086 P / S: 1Kit Of113.4Ml ( Q3 ) , P / N. Cho-Bond-50-02-1030-0000, Dischobond Adhesive1030, For O-Ring With Primer1086 P / S: 1Kit Of113.4Ml ( Q3 ) , P / N. 15122013-6, Dis. Glue Cyanolite Type 201, Pack Size: 1 Pack Of 2 Gms ( Q3 ) , P / N. 15120258-4, Dis. Glue Eccobond 104 ( A+ B ) , Emerson & Cuming Or Henkal Pack Size: 1 Kit Of 500 Gms ( Q3 ) , P / N. 1754-631, Dis. Tensol Cement No. 70, Ici. , Pack Size: 1 Pack Of 225 Ml ( Q3 ) , P / N. 15120230-2, Dis. E-Solder 3021 Glue, A+ B ( Silver-Conductive-Adhesive ) P / Siz: 1 Kit Of 2.2566 Kg ( Q3 ) , P / N. 15120230-2, Dis. E-Solder 3021 Glue, A+ B ( Silver-Conductive-Adhesive ) Pack Size: 1Kit Of2.2566Kg ( Q3 ) , P / N. Hal2908090000-16, Dis. Solder Paste, Ncsmq92h Pack Size: 1 Pkt Of 500 Gms ( Q3 ) , P / N. Hal2908090015-68, Dis. Solder Flux Gel No Clean, Pack Size: 1 Pack Of 10 Gms ( Q3 ) , P / N. Hal2032040010-82, Dis. Adhesive Bostik 1782, Pack Size: 1 Pack Of 1000 Gms ( Q3 ) , P / N. 01752-00297, Dis. Primer, Silcoset 105 With Curing Agent A Pack Size: 1 Kit Of 1010 Gms ( Q3 ) , P / N. Hal2305810010-34, Dis. Primer For Silicon Rubber, Clear, Dc Pack Size: 1 Pack Of 500 Ml ( Q3 ) , P / N. 15410060-4, Dis. Primer Ref. 1201, Pack Size: 1 Pack Of 348 Ml ( Q3 ) , Hal2309500430-63, Dis. Adhesive Pressure Sensitive, 9469-3M, 0.01 Thick, 6.0 Wide. P / S: 1 Roll Of 1 Roll ( Q3 ) , P / N. Hal2309500430-63, Dis. Adhesive Pressure Sensitive, 9469-3M, 0.01 Thick, 6.0 Wide. P / S: 1Roll Of 1 Rol ( Q3 ) , P / N. 15160084-7, Dis. Lubricant Molykote Aerosol 400Ml, Pack Size: 1 Pack Of 0.3 Kg ( Q3 ) , P / N. 15160084-7, Dis. Lubricant Molykote Aerosol 400Ml. Pack Size: 1 Pack Of 0.3 Kg ( Q3 ) , P / N. 1176-0010-44, Dis. Temporary Solder Mask, 8 Oz. Bottle-1030 Pack Size: 1 Pack Of 237 Ml ( Q3 ) Total Quantity : 692
Basic Detail
Tender No GEM/2024/B/4686082
Bidding Type Tender
Location
City SULTANPUR
State Uttar Pradesh
Key Dates
Publish Date 24 Feb 2024
Submission Date 16 Mar 2024
Open Date 16 Mar 2024
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Not Available
Document List
eccb4e83-315b-4a82-8208-c67cfbb008e5.pdf
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Tender Timeline

Feb 24, 2024
11:30 IST

Tender Published

Tender notice published.

Completed
Mar 16, 2024
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Completed
Mar 16, 2024

Bid Opening Date

Technical bids will be opened and evaluated.

Completed

Tender Documents

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eccb4e83-315b-4a82-8208-c67cfbb008e5.pdf

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