}
  • Home   ›
  •   Indian Tenders   › Tender Notice : 42457648

    • Bids Are Invited For Hardware Mother Board , Ram Usb Ddr3 , Dmp Chip Ups , Lamp Clobus , Logic Card , Server Mother Board , Ups Bty , Gear Assy , Monitor , Processor I5 , Fuser Assy Total Quantity : 20, Ambala-Haryana

    Indian Army has published Bids Are Invited For Hardware Mother Board , Ram Usb Ddr3 , Dmp Chip Ups , Lamp Clobus , Logic Card , Server Mother Board , Ups Bty , Gear Assy , Monitor , Processor I5 , Fuser Assy Total Quantity : 20. Submission Date for this Tender is 05-03-2024. UPS Tenders in Ambala Haryana. Bidders can get complete Tender details and download the document.




    Tender Notice

    42457648
    Bids Are Invited For Hardware Mother Board , Ram Usb Ddr3 , Dmp Chip Ups , Lamp Clobus , Logic Card , Server Mother Board , Ups Bty , Gear Assy , Monitor , Processor I5 , Fuser Assy Total Quantity : 20
    Open Tender
    Indian
    Haryana
    Ambala
    05-03-2024

    Tender Details

    Bids Are Invited For Hardware Mother Board , Ram Usb Ddr3 , Dmp Chip Ups , Lamp Clobus , Logic Card , Server Mother Board , Ups Bty , Gear Assy , Monitor , Processor I5 , Fuser Assy Total Quantity : 20

    Key Value

    Document Fees
    Refer document
    EMD
    Refer document
    Tender Value
    Refer document
    Disclaimer :
    We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
    Tell us about your Product / Services,
    We will Find Tenders for you
    Cnet Technologies

    We are a group of professionals specializing in custom software development, web development, mobile app development, IOT base solutions, web design, graphics & Enterprise solutions provid.

    About Us

    Services

    Browse Tenders

    For Sales Inquiry

    Connect With Us

    Copyright © 2025 · All Rights Reserved. Terms of Usage | Privacy Policy

    For Tender Information Services Visit : TenderDetail