}
  • Home   ›
  •   Indian Tenders   › Tender Notice : 41966475

    • Bids Are Invited For Expendable Item Microcircuit Mc33179 Lmc662 , Mosfet Type Irf 7343 , Cover Protective Dust Seal , Flux Soldering Palte , Alcohel Isoprophyl , Solvent , Solder Soft Grade B Total Quantity : 25, Darjeeling-West Bengal

    Indian Army-IA has published Bids Are Invited For Expendable Item Microcircuit Mc33179 Lmc662 , Mosfet Type Irf 7343 , Cover Protective Dust Seal , Flux Soldering Palte , Alcohel Isoprophyl , Solvent , Solder Soft Grade B Total Quantity : 25. Submission Date for this Tender is 12-02-2024. Integrated Circuit Packages Tenders in Darjeeling West Bengal. Bidders can get complete Tender details and download the document.




    Tender Notice

    41966475
    Bids Are Invited For Expendable Item Microcircuit Mc33179 Lmc662 , Mosfet Type Irf 7343 , Cover Protective Dust Seal , Flux Soldering Palte , Alcohel Isoprophyl , Solvent , Solder Soft Grade B Total Quantity : 25
    Open Tender
    Indian
    West Bengal
    Darjeeling
    12-02-2024

    Tender Details

    Bids Are Invited For Expendable Item Microcircuit Mc33179 Lmc662 , Mosfet Type Irf 7343 , Cover Protective Dust Seal , Flux Soldering Palte , Alcohel Isoprophyl , Solvent , Solder Soft Grade B Total Quantity : 25

    Key Value

    Document Fees
    Refer document
    EMD
    Refer document
    Tender Value
    Refer document
    Disclaimer :
    We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
    Tell us about your Product / Services,
    We will Find Tenders for you
    Cnet Technologies

    We are a group of professionals specializing in custom software development, web development, mobile app development, IOT base solutions, web design, graphics & Enterprise solutions provid.

    About Us

    Services

    Browse Tenders

    For Sales Inquiry

    Connect With Us

    Copyright © 2024 · All Rights Reserved. Terms of Usage | Privacy Policy

    For Tender Information Services Visit : TenderDetail