}
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    • Tender For Interconnection Of Ht Panel With Lt Panels At Research And Innovation Park,Iit Delhi, delhi-Delhi

    National Buildings Construction Corporation Limited has published Tender For Interconnection Of Ht Panel With Lt Panels At Research And Innovation Park,Iit Delhi. Submission Date for this Tender is 07-02-2024. Overhead Line Tenders in delhi Delhi. Bidders can get complete Tender details and download the document.




    Tender Notice

    41942418
    Tender For Interconnection Of Ht Panel With Lt Panels At Research And Innovation Park,Iit Delhi
    Tender
    Indian
    Delhi
    Delhi
    07-02-2024

    Tender Details

    Interconnection Of Ht Panel With Lt Panels At Research And Innovation Park, Iit Delhi Tender For Interconnection Of Ht Panel With Lt Panels At Research And Innovation Park ( Ri Park ) , Iit Delhi, Hauz Khas New Delhi

    Key Value

    Document Fees
    INR 11800 /-
    EMD
    INR 10356748.0 /-
    Tender Value
    INR 1.03 Crore /-
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