Tender For Supply, Installation And Maintenance Of Electronics Sensors, Development Boards, Electronics Equipment And Other Allied Materials For Iot Lab And Fablab For Tamil Nadu Technology Hub Itnt Foundation
Tender Overview
Project Description
Tender For Supply, Installation And Maintenance Of Electronics Sensors, Development Boards, Electronics Equipment And Other Allied Materials For Iot Lab And Fablab For Tamil Nadu Technology Hub Itnt Foundation ; 1 Proximity Inductive Sensor 2 Proximity Inductive Sensor 3 Proximity Inductive Sensor 4 Proximity Inductive Sensor. 5 Position Transmitter 6 Proximity Magnetic Sensor 7 Retro Reflective Sensor 8 Distance Sensor 9 Colour Sensor 10 Rain Sensor 11 Temperature And Humidity Sensor 12 Bluetooth Module 13 5G Module 14 Fingerprint Reader Module 15 Assorted Resistor Kit 16 Assorted Capacitor Kit 17 Signal Convertor 18 Piezoelectric Ultrasonic Sensors 19 Ldr ( Light Dependent Resistor ) Sensor Module 20 Lidar Module 21 Ir Sensor 22 Three Axis Accelerometer & Gyroscope 23 Microstepping Motor Driver With Motion Engine 24 Push Button 25 Wire Stripper 26 Glue Gun 27 Assorted Jumper Wire 28 Rainbow Wire Roll 29 Antistatic Gloves Small Pair 30 Antistatic Gloves Medium Pair 31 Antistatic Gloves Large Pair 32 Antistatic Dissipative Mat Roll 33 Inertial Measurement Unit 34 Optical Pulse Oximeter And Heart-Rate Sensor 35 Muscle Sensor 36 Ecg Breakout Board 37 Eeg Development Sensor 38 Brain Machine Interface 39 Development Board 40 Development Board 41 Ai And Computer Vision Development Board 42 Ai And Computer Vision Development Kit 43 Development Board 44 Digital Multimeter 45 Digital Clamp Meter 46 Soldering Station 47 Soldering Supply Kit 48 Helping Hand 49 Desoldering Station 50 Screwdriver Set 51 Regulated Power Supply Unit 52 Lcr Meter 53 Dc Powerload 54 200 Mhz Mixed Signal Oscilloscope 55 200Mhz Mixed Domain Oscilloscope 56 Function Generator
Corrigendum
| Sr No | Corrigendum Date | Corrigendum | Type | New Submission Date |
|---|---|---|---|---|
| 1 | 22-Jan-2024 | Date extension corrigendum | Date | 02-Feb-2024 |
| 2 | 24-Jan-2024 | Reply to pre-bid queries and corrigendum to RFP | Technical Bid | 02-Feb-2024 |
BOQ
| Sl. No. | Item Description |
| 1 | Proximity inductive sensor |
| 2 | Proximity inductive sensor |
| 3 | Proximity inductive sensor |
| 4 | Proximity inductive sensor. |
| 5 | Position transmitter |
| 6 | Proximity magnetic sensor |
| 7 | Retro reflective sensor |
| 8 | Distance sensor |
| 9 | Colour sensor |
| 10 | Rain Sensor |
| 11 | Temperature and humidity sensor |
| 12 | Bluetooth module |
| 13 | 5G module |
| 14 | Fingerprint reader module |
| 15 | Assorted Resistor Kit |
| 16 | Assorted Capacitor Kit |
| 17 | Signal convertor |
| 18 | Piezoelectric Ultrasonic Sensors |
| 19 | LDR (Light dependent resistor) sensor module |
| 20 | LIDAR Module |
| 21 | IR Sensor |
| 22 | Three axis Accelerometer & Gyroscope |
| 23 | microstepping motor driver with motion engine |
| 24 | Push button |
| 25 | Wire stripper |
| 26 | Glue Gun |
| 27 | Assorted Jumper Wire |
| 28 | Rainbow wire roll |
| 29 | Antistatic gloves Small pair |
| 30 | Antistatic gloves Medium pair |
| 31 | Antistatic gloves Large pair |
| 32 | Antistatic Dissipative Mat Roll |
| 33 | Inertial measurement unit |
| 34 | Optical Pulse Oximeter and Heart-Rate Sensor |
| 35 | Muscle Sensor |
| 36 | ECG Breakout board |
| 37 | EEG development sensor |
| 38 | Brain machine interface |
| 39 | Development board |
| 40 | Development board |
| 41 | AI and computer vision development board |
| 42 | AI and computer vision development kit |
| 43 | Development board |
| 44 | Digital Multimeter |
| 45 | Digital clamp meter |
| 46 | Soldering Station |
| 47 | Soldering Supply kit |
| 48 | Helping hand |
| 49 | Desoldering station |
| 50 | Screwdriver Set |
| 51 | Regulated power supply unit |
| 52 | LCR Meter |
| 53 | DC Powerload |
| 54 | 200 MHz Mixed Signal Oscilloscope |
| 55 | 200MHz Mixed Domain Oscilloscope |
| 56 | Function Generator |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedCorrigendum-1 Issued
Clarifications on tender conditions and amendments issued.
CompletedCorrigendum-2 Issued
Clarifications on tender conditions and amendments issued.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
CompletedBid Opening Date
Technical bids will be opened and evaluated.
CompletedTender Documents
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