Educational and Research Institute Boards / Undertakings / PSU Closing in 0 days TDR #39272443

Tender For Semiconductor Wafer I.E. Gan / Algan Hemt Structure On 4-Inch Diameter Sic

Issued by Boards / Undertakings / PSU · delhi, Delhi
Tender Value
Ref. Documents
Estimated cost
Bid Submission
03 Oct 2023
0 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
500
Non-refundable
Tender Type
Online

Tender Overview

Organization
Click here to view tendering authority
Tender ID
Click here to view tender id
Competition Type
NCB
Bidding Type
Tender
Location / State
delhi → Delhi
EMD Exemption
Not Available
Quantity
Not Available
Website
Click here to view website
Contact Person
Click here to view contact person
Address
Click here to view address

Project Description

Tender For Semiconductor Wafer I.E. Gan / Algan Hemt Structure On 4-Inch Diameter Sic

Corrigendum

Sr No Corrigendum Date Corrigendum Type New Submission Date
1 18-Sep-2023 Date Extension Date 25-Sep-2023
2 25-Sep-2023 Second Date Extension Date 03-Oct-2023

BOQ

Name of Work:
Sl. No. Item Description
1Semiconductor Wafer
2GaN/AlGaN HEMT Structure on 4-inch diameter SiC

AI Tender Summary

OUR REF NO 39272443
AUTHORITY Boards / Undertakings / PSU
TENDER VALUE Ref. Documents
LAST DATE 03-10-2023
Authority
Authority Name Delhi University
Work Description Tender For Semiconductor Wafer I.E. Gan / Algan Hemt Structure On 4-Inch Diameter Sic
Basic Detail
Tender No DOES/SDRL/SERB-DST/01
Bidding Type Tender
Location
City delhi
State Delhi
Key Dates
Publish Date 25 Sep 2023
Submission Date 03 Oct 2023
Open Date 04 Oct 2023
Finance
Tender Value Ref. Documents
Tender Fee 500
EMD Ref. Documents
Exemption Not Available
Document List
73088fd3-3e4d-4636-b0e7-a928794a55ae.html
BOQ_806883.xls
NITDST01.pdf
Tendernotice_1.pdf
AI-generated summary — verify details from the official tender portal before submission.

Unlock Full AI Tender Summary

Get instant access to the complete AI-generated analysis — scope, eligibility, timeline & more.

Instant Access Secure Free
Your details are secure and used only for document delivery.

Tender Timeline

Sep 25, 2023
11:30 IST

Tender Published

Tender notice published.

Completed
Sep 25, 2023
18:00 IST

Corrigendum-1 Issued

Clarifications on tender conditions and amendments issued.

Completed
Oct 03, 2023
18:00 IST

Corrigendum-2 Issued

Clarifications on tender conditions and amendments issued.

Completed
Oct 03, 2023
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Completed
Oct 04, 2023

Bid Opening Date

Technical bids will be opened and evaluated.

Completed

Tender Documents

Download All (ZIP) ↓
html

73088fd3-3e4d-4636-b0e7-a928794a55ae.html

xls

BOQ_806883.xls

pdf

NITDST01.pdf

pdf

Tendernotice_1.pdf

Disclaimer

We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender