}
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    • Tender For Semiconductor Wafer I.E. Gan / Algan Hemt Structure On 4-Inch Diameter Sic, delhi-Delhi

    Delhi University has published Tender For Semiconductor Wafer I.E. Gan / Algan Hemt Structure On 4-Inch Diameter Sic. Submission Date for this Tender is 03-10-2023. Semiconductor Wafers Tenders in delhi Delhi. Bidders can get complete Tender details and download the document.




    Tender Notice

    39272443
    Corrigendum : Tender For Semiconductor Wafer I.E. Gan / Algan Hemt Structure On 4-Inch Diameter Sic
    Open Tender
    Indian
    Delhi
    delhi
    03-10-2023

    Tender Details

    Tender For Semiconductor Wafer I.E. Gan / Algan Hemt Structure On 4-Inch Diameter Sic

    Corrigendum Details

    Sr No CorrigendumDate Corrignedum CorrigendumType NewSubmissionDate
    1 18-Sep-2023 Date Extension Date 25-09-2023
    2 25-Sep-2023 Second Date Extension Date 03-10-2023

    Key Value

    Document Fees
    INR 500 /-
    EMD
    Refer document
    Tender Value
    Refer document

    BOQ Items

    Name of Work:
    Sl. No. Item Description
    1Semiconductor Wafer
    2GaN/AlGaN HEMT Structure on 4-inch diameter SiC
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