Tender For Targets And Substrates

Sharing tender

Tender For Targets And Substrates; 1 Targets 1.01 Palladium ( Pd ) 99.9~99.95% Pure, 2 ( 50.8 Mm ) Dia. X 3 Mm Thick 1.02 Cobalt ( Co ) 99. 9~99.95% Pure, 2 ( 50.8 Mm ) Dia. X 1 Mm Thick 1.03 Nickel ( Ni ) 99.9~99.95% Pure, 2 ( 50.8 Mm ) Dia. X 1 Mm Thick 1.04 Platinum ( Pt ) 99.9~99.95% Pure, 2 ( 50.8 Mm ) Dia. X 3 Mm Thick 1.05 Chromium ( Cr ) 99.9~99.95% Pure, 2 ( 50.8 Mm ) Dia. X 3 Mm Thick 1.06 Gold ( Au ) 99.9~99. 95% Pure, 2.244 ( 57 Mm ) Dia. X 1 Mm Thick 1.07 Gold ( Au ) 99.9~99.95% Pure, 2 ( 50.8 Mm ) Dia. X 3 Mm Thick 1.08 Silicon Carbide ( Sic ) 99.9~99.95% Pure, 2 ( 50.8 Mm ) Dia. X 3 Mm Thick 1.09 Molybdenum ( Mo ) 99.9~99.95% Pure, 2 ( 50.8 Mm ) Dia. X 5 Mm Thick 2 Substrates 2.01 Silicon N-Type ( 100 ) , Single Side Polished, 500 Μm Thick, Resistivity: 10-100 Ω-Cm Size: 6 Inch Diameter Wafer 2.02 Silicon N-Type ( 100 ) , Single Side Polished, 500 Μm Thick, Resistivity: 10-100 Ω-Cm Size: 4 Inch Diameter Wafer 2.03 Silicon N-Type ( 100 ) , Single Side Polished, 500 Μm Thick, Resistivity: 10-100 Ω-Cm Size: 2 Inch Diameter Wafer 2.04 Sapphire Window ( Un-Coated ) , Double Side Optical Polished, Surface Finish: 60 / 40 ( Scratch / Dig ) , Parallelism: <5 Arc-Minutes, Surface Figure: <5Λ @633 Nm, Edge Profile: Protective Bevel Size: 25 Mm Diameter X 2 Mm Thick