}
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    • Tender For Precision Cutting Diamond Wafering Blades, tarapur-Maharashtra

    Directorate Of Purchase And Stores has published Tender For Precision Cutting Diamond Wafering Blades. Submission Date for this Tender is 30-05-2023. Machine Tools Tenders in tarapur Maharashtra. Bidders can get complete Tender details and download the document.




    Tender Notice

    37448758
    Tender For Precision Cutting Diamond Wafering Blades
    Tender
    Indian
    Maharashtra
    Tarapur
    30-05-2023

    Tender Details

    Precision Cutting Diamond Wafering Blades Testing, Packing, Supply, Safe Delivery And Warranty Of Precision Cutting Diamond Wafering Blades , Precision Cutting Diamond Wafering Blades: A) High Concentration For Ductile Material As Per Specification Mentioned In Annexure-1. Size: Diameter = 4 Thickness = 0.012 Central Hole Diameter = 0.5 , B) Low Concentration For Hard Materials As Per Specification Mentioned In Annexure-1. Size: Diameter = 4 Thickness = 0.012 Central Hole Diameter = 0.5

    Key Value

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