Bids Are Invited For Electronic S Components For Hvps, Klystron Filament & Relay Driver (Q3) Mse Total Quantity : 1
Tender Value
Ref. Documents
Estimated cost
Bid Submission
17 Apr 2023
0 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem
Tender Overview
Organization
Tender ID
Competition Type
NCB
Bidding Type
Tender
Location / State
Thane → Maharashtra
EMD Exemption
Not Available
Quantity
Not Available
Website
Contact Person
Address
Project Description
Bids Are Invited For Electronic S Components For Hvps, Klystron Filament & Relay Driver ( Q3 ) Mse Total Quantity : 1
Corrigendum
| Sr No | Corrigendum Date | Corrigendum | Type | New Submission Date |
|---|---|---|---|---|
| 1 | 03-Apr-2023 | 08-Apr-2023 | ||
| 2 | 06-Apr-2023 | 17-Apr-2023 |
AI Tender Summary
Tender Timeline
Apr 06, 2023
11:30 IST
Tender Published
Tender notice published.
Completed
Apr 08, 2023
18:00 IST
Corrigendum-1 Issued
Clarifications on tender conditions and amendments issued.
Completed
Apr 17, 2023
18:00 IST
Corrigendum-2 Issued
Clarifications on tender conditions and amendments issued.
CompletedApr 17, 2023
17:00 IST
Bid Submission Deadline
Online submission via eProcurement portal.
CompletedApr 17, 2023
Bid Opening Date
Technical bids will be opened and evaluated.
Completed