}
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    • Tender For Diamond Wafering Blade, indore-Madhya Pradesh

    Directorate Of Purchase And Stores has published Tender For Diamond Wafering Blade. Submission Date for this Tender is 27-03-2023. Cutting Crimping and Punching Tools Tenders in indore Madhya Pradesh. Bidders can get complete Tender details and download the document.




    Tender Notice

    36647240
    Tender For Diamond Wafering Blade
    Open Tender
    NCB
    Madhya Pradesh
    Indore
    27-03-2023

    Tender Details

    Supply Of Diamond Wafering Blade , A. Diamond Wafering Blade- The Blade Is To Be Used With Diamond Wafering Saw / Low Speed Diamond Precision Saw / High Speed Diamond Precision Saw. The Blade Used To Make Wafers Of Hard And Brittle Substance Like Ceramics, Silicon, Carbides, Refractories, Glass, Quartz Etc. The Blade Is Thin And Continuous Wheel Type. B. Specifications- 1. Inner Diameter / Arbour-0.5” Inch ( 12.7Mm ) 2. Outer Diameter-4”Inch ( 101.6Mm ) 3. Thickness-0.012” Inch ( 0.30Mm ) 4. Material-Low Concentration Diamond Impregnated Wafering Blades C. Certification The Original Product Manufacturer Should Be Iso / Iec 17025:2017, Iso 9001:2015 Certified. D. References A List Of Customers Along With Names Of The Contact Persons Should Be Provided. ( As Described In Attached Diamond_Wafering_Blade.Pdf File )

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