}
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    • Tender For Multi Wire Saw (Mws) Cutting Machine For Slicing Of Silicon Carbide (Sic) Single Crystal Ingot/Boule, hyderabad-Telangana

    Department Of Electronics And Information Technology has published Tender For Multi Wire Saw (Mws) Cutting Machine For Slicing Of Silicon Carbide (Sic) Single Crystal Ingot/Boule. Submission Date for this Tender is 13-02-2023. Cutting Crimping and Punching Tools Tenders in hyderabad Telangana. Bidders can get complete Tender details and download the document.




    Tender Notice

    35817733
    Tender For Multi Wire Saw (Mws) Cutting Machine For Slicing Of Silicon Carbide (Sic) Single Crystal Ingot/Boule
    Tender
    Indian
    Telangana
    Hyderabad
    13-02-2023

    Tender Details

    Multi Wire Saw (Mws) Cutting Machine For Slicing Of Silicon Carbide (Sic) Single Crystal Ingot/Boule Supply, Installation, Commissioning And Demonstration Of Multi Wire Saw (Mws) Cutting Machine For Slicing Of Silicon Carbide (Sic) Single Crystal Ingot

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