}
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    • Tender For Supply Of Sputtering Targets, mumbai-Maharashtra

    Directorate Of Purchase And Stores has published Tender For Supply Of Sputtering Targets. Submission Date for this Tender is 26-01-2023. Indium Tenders in mumbai Maharashtra. Bidders can get complete Tender details and download the document.




    Tender Notice

    35530618
    Tender For Supply Of Sputtering Targets
    Tender
    Indian
    Maharashtra
    Mumbai
    26-01-2023

    Tender Details

    Supply Of Si Sputtering Targets As Per Annexure Attached , Si Sputtering Target Material: Si Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , C Sputtering Target Material: C Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Al2o3 Sputtering Target Material: Al2o3 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Linbo3 Sputtering Target Material: Linbo3 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , V2o5 Sputtering Target Material: V2o5 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Zro2 Sputtering Target Material: Zro2 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Fe Sputtering Target Material: Fe Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 1 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Li1.2Ni0.13Co0.13Mn0.54O2 Sputtering Target Material: Li1.2Ni0.13Co0.13Mn0.54O2 ( Li Rich Nmc333 ) Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Li1.2Ni0.32Co0.04Mn0.44O2 Sputtering Target Material: Li1.2Ni0.32Co0.04Mn0.44O2 ( Li Rich Nmc811 ) Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm

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