Science and Technology Government Departments Closing in 0 days TDR #35530618

Tender For Supply Of Sputtering Targets

Issued by Government Departments · mumbai, Maharashtra
Tender Value
Ref. Documents
Estimated cost
Bid Submission
26 Jan 2023
0 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Online

Tender Overview

Organization
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Tender ID
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Competition Type
NCB
Bidding Type
Tender
Location / State
mumbai → Maharashtra
EMD Exemption
Not Available
Quantity
Not Available
Website
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Contact Person
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Address
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Project Description

Supply Of Si Sputtering Targets As Per Annexure Attached , Si Sputtering Target Material: Si Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , C Sputtering Target Material: C Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Al2o3 Sputtering Target Material: Al2o3 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Linbo3 Sputtering Target Material: Linbo3 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , V2o5 Sputtering Target Material: V2o5 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Zro2 Sputtering Target Material: Zro2 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Fe Sputtering Target Material: Fe Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 1 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Li1.2Ni0.13Co0.13Mn0.54O2 Sputtering Target Material: Li1.2Ni0.13Co0.13Mn0.54O2 ( Li Rich Nmc333 ) Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Li1.2Ni0.32Co0.04Mn0.44O2 Sputtering Target Material: Li1.2Ni0.32Co0.04Mn0.44O2 ( Li Rich Nmc811 ) Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm

BOQ

Item Details: Sputtering Targets
Sl. No. Item Description
1Si sputtering targetMaterial: SiPurity: 99.99%Diameter: 76.2 mm (3 inch)Thicknesss: 3 mm (Tolerance: ± 0.1 mm),Bonding: Indium bonded Copper (Cu) backing plate of thickness 2mm
2C sputtering targetMaterial: CPurity: 99.99%Diameter: 76.2 mm (3 inch)Thicknesss: 3 mm (Tolerance: ± 0.1 mm),Bonding: Indium bonded Copper (Cu) backing plate of thickness 2mm
3Al2O3 sputtering targetMaterial: Al2O3Purity: 99.99%Diameter: 76.2 mm (3 inch)Thicknesss: 3 mm (Tolerance: ± 0.1 mm),Bonding: Indium bonded Copper (Cu) backing plate of thickness 2mm
4LiNbO3 sputtering targetMaterial: LiNbO3Purity: 99.99%Diameter: 76.2 mm (3 inch)Thicknesss: 3 mm (Tolerance: ± 0.1 mm),Bonding: Indium bonded Copper (Cu) backing plate of thickness 2mm
5V2O5 sputtering targetMaterial: V2O5Purity: 99.99%Diameter: 76.2 mm (3 inch)Thicknesss: 3 mm (Tolerance: ± 0.1 mm),Bonding: Indium bonded Copper (Cu) backing plate of thickness 2mm
6ZrO2 sputtering targetMaterial: ZrO2Purity: 99.99%Diameter: 76.2 mm (3 inch)Thicknesss: 3 mm (Tolerance: ± 0.1 mm), Bonding: Indium bonded Copper (Cu) backing plate of thickness 2mm
7Fe sputtering targetMaterial: FePurity: 99.99%Diameter: 76.2 mm (3 inch)Thicknesss: 1 mm (Tolerance: ± 0.1 mm),Bonding: Indium bonded Copper (Cu) backing plate of thickness 2mm
8Li1.2Ni0.13Co0.13Mn0.54O2 sputtering targetMaterial: Li1.2Ni0.13Co0.13Mn0.54O2 (Li rich NMC333)Purity: 99.99%Diameter: 76.2 mm (3 inch)Thicknesss: 3 mm (Tolerance: ± 0.1 mm),Bonding: Indium bonded Copper (Cu) backing plate of thickness 2mm
9Li1.2Ni0.32Co0.04Mn0.44O2 sputtering targetMaterial: Li1.2Ni0.32Co0.04Mn0.44O2 (Li rich NMC811)Purity: 99.99%Diameter: 76.2 mm (3 inch)Thicknesss: 3 mm (Tolerance: ± 0.1 mm),Bonding: Indium bonded Copper (Cu) backing plate of thickness 2mm

AI Tender Summary

OUR REF NO 35530618
AUTHORITY Government Departments
TENDER VALUE Ref. Documents
LAST DATE 26-01-2023
Authority
Authority Name Directorate Of Purchase And Stores
Work Description Supply Of Si Sputtering Targets As Per Annexure Attached , Si Sputtering Target Material: Si Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , C Sputtering Target Material: C Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Al2o3 Sputtering Target Material: Al2o3 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Linbo3 Sputtering Target Material: Linbo3 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , V2o5 Sputtering Target Material: V2o5 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Zro2 Sputtering Target Material: Zro2 Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Fe Sputtering Target Material: Fe Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 1 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Li1.2Ni0.13Co0.13Mn0.54O2 Sputtering Target Material: Li1.2Ni0.13Co0.13Mn0.54O2 ( Li Rich Nmc333 ) Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm , Li1.2Ni0.32Co0.04Mn0.44O2 Sputtering Target Material: Li1.2Ni0.32Co0.04Mn0.44O2 ( Li Rich Nmc811 ) Purity: 99.99% Diameter: 76.2 Mm ( 3 Inch ) Thicknesss: 3 Mm ( Tolerance: ± 0.1 Mm ) , Bonding: Indium Bonded Copper ( Cu ) Backing Plate Of Thickness 2Mm
Basic Detail
Tender No DPS/CPU/04/A3/3917
Bidding Type Tender
Location
City mumbai
State Maharashtra
Key Dates
Publish Date 30 Dec 2022
Submission Date 26 Jan 2023
Open Date 27 Jan 2023
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Not Available
Document List
ANNEXURE.pdf
BOQ_770050.xls
DECLARATION-FORMS.rar
6393df75-beb2-4aa7-80c1-95d427404072.html
NIT_CHECKLIST.pdf
NIT_COMMERCIAL_TERMS.pdf
Note-to-Vendors.pdf
Tendernotice_1.pdf
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Tender Timeline

Dec 30, 2022
11:30 IST

Tender Published

Tender notice published.

Completed
Jan 26, 2023
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Completed
Jan 27, 2023

Bid Opening Date

Technical bids will be opened and evaluated.

Completed

Tender Documents

Download All (ZIP) ↓
pdf

ANNEXURE.pdf

xls

BOQ_770050.xls

rar

DECLARATION-FORMS.rar

html

6393df75-beb2-4aa7-80c1-95d427404072.html

pdf

NIT_CHECKLIST.pdf

pdf

NIT_COMMERCIAL_TERMS.pdf

pdf

Note-to-Vendors.pdf

pdf

Tendernotice_1.pdf

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