}
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    • Bids Are Invited For 100 Mm Dia X 0.35 Mm Thick Fully Sintered Diamond Cutting Blade (Q3) , 100 Mm Dia X 0.1 Mm Thick Sintered Diamond Cutting Blade With 0.5 Inch Arbor Flange (Q3) , 150 Mm Dia X0.45 Mm Thick Edge Sintered Diamond Cutting Blade (Q3) , Hyderabad-Telangana

    Ministry Of Defence has published Bids Are Invited For 100 Mm Dia X 0.35 Mm Thick Fully Sintered Diamond Cutting Blade (Q3) , 100 Mm Dia X 0.1 Mm Thick Sintered Diamond Cutting Blade With 0.5 Inch Arbor Flange (Q3) , 150 Mm Dia X0.45 Mm Thick Edge Sintered Diamond Cutting Blade (Q3) . Submission Date for this Tender is 31-10-2022. Machine Tools Tenders in Hyderabad Telangana. Bidders can get complete Tender details and download the document.




    Tender Notice

    34295023
    Bids Are Invited For 100 Mm Dia X 0.35 Mm Thick Fully Sintered Diamond Cutting Blade (Q3) , 100 Mm Dia X 0.1 Mm Thick Sintered Diamond Cutting Blade With 0.5 Inch Arbor Flange (Q3) , 150 Mm Dia X0.45 Mm Thick Edge Sintered Diamond Cutting Blade (Q3)
    Tender
    Indian
    Telangana
    Hyderabad
    31-10-2022

    Tender Details

    Bids Are Invited For 100 Mm Dia X 0.35 Mm Thick Fully Sintered Diamond Cutting Blade (Q3) , 100 Mm Dia X 0.1 Mm Thick Sintered Diamond Cutting Blade With 0.5 Inch Arbor Flange (Q3) , 150 Mm Dia X0.45 Mm Thick Edge Sintered Diamond Cutting Blade (Q3) Total Quantity : 31

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