Bids Are Invited For Hafnium Oxide (Hfo2) Target Bonded With Copper Backing Plate (Q3) , Silicon Dioxide (Sio2) Target Bonded With Copper Backing Plate (Q3) , Titanium Dioxide (Tio2) Target Bonded With Copper Backing Plate (Q3) , Aluminium Oxide(Al2o3) Ta
Tender Overview
Project Description
Bids Are Invited For Hafnium Oxide (Hfo2) Target Bonded With Copper Backing Plate (Q3) , Silicon Dioxide (Sio2) Target Bonded With Copper Backing Plate (Q3) , Titanium Dioxide (Tio2) Target Bonded With Copper Backing Plate (Q3) , Aluminium Oxide(Al2o3) Target Bonded With Copper Backing Plate (Q3) , Tantalum Oxide (Ta2o5) Target Bonded With Copper Backing Plate (Q3) , Zirconium Oxide (Zro2) Target Bonded With Copper Backing Plate (Q3) , Vanadium Oxide (Vo2) Target Bonded With Copper Backing Plate (Q3) , Magnesium Fluoride (Mgf2) Target Bonded With Copper Backing Plate (Q3) , Zinc Oxide (Zno) Target Bonded With Copper Backing Plate (Q3) ,Indium Tin Oxide (Ito) Target Bonded With Copper Backingplate (Q3) , Silicon (Si) Target Bonded With Copper Backingplate (Q3) , Silicon Nitride (Si3n4) Target (Q3) , Germanium(Ge) Target Bonded With Copper Backing Plate (Q3) ,Chromium (Cr) Target Bonded With Copper Backing Plate(Q3) , Silver (Ag) Target (Q3) , Aluminium (Al) Target (Q3) ,Copper (Cu) Target (Q3) , Tungsten (W) Target (Q3) ,Germanium Antimony Telluride (Ge2sb2te5) Target (Q3) ,Tungsten Disulfide (Ws2) Targetbonded With Copper Backingplate (Q3) Total Quantity : 26
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
CompletedTender Documents
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