Heavy Industries and Public Enterprises Government Departments Closing in 0 days TDR #3259958

Auction Sale of P V C Powder - Sim card,Scrap of P V C,M. S. Scrap,Scrap of Empty Plastic Reel of Chip Modules,Scrap of Stainless Steel,Scrap of Drop Wire.

Issued by Government Departments · mumbai, Maharashtra
Tender Value
Ref. Documents
Estimated cost
Bid Submission
30 Apr 2012
0 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Online

Tender Overview

Competition Type
NCB
Bidding Type
Tender
Location / State
mumbai → Maharashtra
EMD Exemption
Not Available
Quantity
Not Available

Project Description

Auction Sale of P V C Powder - Sim card,Scrap of P V C,M. S. Scrap,Scrap of Empty Plastic Reel of Chip Modules,Scrap of Stainless Steel,Scrap of Drop Wire,PVC Cut piece Scrap,Copper Scrap,Alluminium Scrap,Silver Sludge,Brass Alloy,Tool Die Scrap,Brass Scrap,Non Moving Scrap Modems & Accessories,Wave Soldering Machine,Injection Moulding Machine Engel IMM-2.

AI Tender Summary

OUR REF NO 3259958
AUTHORITY Government Departments
TENDER VALUE Ref. Documents
LAST DATE 30-04-2012
Authority
Authority Name Metal Scrap Trading Corporation Limited
Work Description Auction Sale of P V C Powder - Sim card,Scrap of P V C,M. S. Scrap,Scrap of Empty Plastic Reel of Chip Modules,Scrap of Stainless Steel,Scrap of Drop Wire,PVC Cut piece Scrap,Copper Scrap,Alluminium Scrap,Silver Sludge,Brass Alloy,Tool Die Scrap,Brass Scrap,Non Moving Scrap Modems & Accessories,Wave Soldering Machine,Injection Moulding Machine Engel IMM-2.
Basic Detail
Tender No MSTC/WRO/TELECOM FACTORY,BSNL/1/DEONAR/12-13/397[48640]
Bidding Type Tender
Location
City mumbai
State Maharashtra
Key Dates
Publish Date 23 Apr 2012
Submission Date 30 Apr 2012
Open Date 30 Apr 2012
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Not Available

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Tender Timeline

Apr 23, 2012
11:30 IST

Tender Published

Tender notice published.

Completed
Apr 30, 2012
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Completed
Apr 30, 2012

Bid Opening Date

Technical bids will be opened and evaluated.

Completed

Tender Documents

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