Auction Sale of P V C Powder - Sim card,Scrap of P V C,M. S. Scrap,Scrap of Empty Plastic Reel of Chip Modules,Scrap of Stainless Steel,Scrap of Drop Wire.
Tender Overview
Project Description
Auction Sale of P V C Powder - Sim card,Scrap of P V C,M. S. Scrap,Scrap of Empty Plastic Reel of Chip Modules,Scrap of Stainless Steel,Scrap of Drop Wire,PVC Cut piece Scrap,Copper Scrap,Alluminium Scrap,Silver Sludge,Brass Alloy,Tool Die Scrap,Brass Scrap,Non Moving Scrap Modems & Accessories,Wave Soldering Machine,Injection Moulding Machine Engel IMM-2.
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
CompletedBid Opening Date
Technical bids will be opened and evaluated.
CompletedTender Documents
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