Auction Sale of P V C Powder - Sim card,Scrap of P V C,M. S. Scrap,Scrap of Empty Plastic Reel of Chip Modules,Scrap of Stainless Steel,Scrap of Drop Wire.
Tender Value
Ref. Documents
Estimated cost
Bid Submission
30 Apr 2012
0 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Online
Tender Overview
Organization
Tender ID
Competition Type
NCB
Bidding Type
Tender
Location / State
mumbai → Maharashtra
EMD Exemption
Not Available
Quantity
Not Available
Website
Contact Person
Address
Project Description
Auction Sale of P V C Powder - Sim card,Scrap of P V C,M. S. Scrap,Scrap of Empty Plastic Reel of Chip Modules,Scrap of Stainless Steel,Scrap of Drop Wire,PVC Cut piece Scrap,Copper Scrap,Alluminium Scrap,Silver Sludge,Brass Alloy,Tool Die Scrap,Brass Scrap,Non Moving Scrap Modems & Accessories,Wave Soldering Machine,Injection Moulding Machine Engel IMM-2.
AI Tender Summary
Tender Timeline
Apr 23, 2012
11:30 IST
Tender Published
Tender notice published.
CompletedApr 30, 2012
17:00 IST
Bid Submission Deadline
Online submission via eProcurement portal.
CompletedApr 30, 2012
Bid Opening Date
Technical bids will be opened and evaluated.
Completed