}
  • Home   ›
  •   Indian Tenders   › Tender Notice : 31285741

    • Bids Are Invited For Dc Blade , Sensor , Logic Board , Main Board , Head , Pressure Roller , Pressure Roller Upper , Printer Head , Sensor Paper Out , Paper Exit Roller , Motherboard G 41 , Adopter5v Total Quantity : 16, Ambala-Haryana

    Indian Army has published Bids Are Invited For Dc Blade , Sensor , Logic Board , Main Board , Head , Pressure Roller , Pressure Roller Upper , Printer Head , Sensor Paper Out , Paper Exit Roller , Motherboard G 41 , Adopter5v Total Quantity : 16. Submission Date for this Tender is 04-03-2022. Computer Peripheral Tenders in Ambala Haryana. Bidders can get complete Tender details and download the document.




    Tender Notice

    31285741
    Bids Are Invited For Dc Blade , Sensor , Logic Board , Main Board , Head , Pressure Roller , Pressure Roller Upper , Printer Head , Sensor Paper Out , Paper Exit Roller , Motherboard G 41 , Adopter5v Total Quantity : 16
    Tender
    Indian
    Haryana
    Ambala
    04-03-2022

    Tender Details

    Bids Are Invited For Dc Blade , Sensor , Logic Board , Main Board , Head , Pressure Roller , Pressure Roller Upper , Printer Head , Sensor Paper Out , Paper Exit Roller , Motherboard G 41 , Adopter5v Total Quantity : 16

    Key Value

    Document Fees
    Refer document
    EMD
    Refer document
    Tender Value
    Refer document
    Disclaimer :
    We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
    Tell us about your Product / Services,
    We will Find Tenders for you
    Cnet Technologies

    We are a group of professionals specializing in custom software development, web development, mobile app development, IOT base solutions, web design, graphics & Enterprise solutions provid.

    About Us

    Services

    Browse Tenders

    For Sales Inquiry

    Connect With Us

    Copyright © 2025 · All Rights Reserved. Terms of Usage | Privacy Policy

    For Tender Information Services Visit : TenderDetail