Bids Are invited for TEMPERATURE SENSOR - TEMPERATURE SENSOR,PACKAGE(inches):WSON-6, PART NO:TMP117MAIDRVR, MAKE:TEXAS INSTRUMNETS , BLE IC - BLE IC,PACKAGE(inches):MODULE, PART NO:RN4871-V/RM118,AMEK:MICROCHIP TECHNOLOGY , MCU - MCU,PACKAGE(inches):UQFN-

Sharing tender

Bids Are invited for TEMPERATURE SENSOR - TEMPERATURE SENSOR,PACKAGE(inches):WSON-6, PART NO:TMP117MAIDRVR, MAKE:TEXAS INSTRUMNETS , BLE IC - BLE IC,PACKAGE(inches):MODULE, PART NO:RN4871-V/RM118,AMEK:MICROCHIP TECHNOLOGY , MCU - MCU,PACKAGE(inches):UQFN-40,PART NO:PIC18LF47K42-I/MV,MAKE:MICROCHIP TECHNOLOGY , BIAS GENERATOR - BIAS GENERATOR,PACKAGE(inches):QFN-12,PART NO:MAX1932ETC+, MAKE:MAXIM INTEGRATED , INDUCTOR - INDUCTOR,PACKAGE(inches):REEL, PART NO:LB3218T101MV,MAKE:TAIYO YUDEN , OPAMP - OPAMP,PACKAGE(inches):SOT-23-6,PART NO:MAX4488AUT+T,MAKE:MAXIM INTEGRATED , COMPARATOR - COMPARATOR,PACKAGE(inches):SOT-23-5,PART NO:MAX999EUK+T, MAKE:MAXIM INTEGRATED , OPAMP. - OPAMP,PACKAGE(inches):DFN-10,PART NO:LTC6269HDD#PBF,MAKE:ANALOG DEVICES , BATTERY VOLTAGE MANAGEMENT IC - BATTERY VOLTAGE MANAGEMENT IC,PACKAGE(inches):SOT-23-5, PART NO:MCP73832T-2DFI/OT, MAKE:MICROCHIP TECHNOLOGY , ADC - ADC,PACKAGE(inches):16-VQFN EXPOSED PAD, PART NO:ADS7279IRSAT, MAKE:TEXAS INSTRUMENTS , COMPARATOR. - COMPARATOR,PACKAGE(inches):SOT-23-5,PART NO:MAX987EUK+T, MAKE:MAXIM INTEGRATED , VOLTAGE REGULATOR - VOLTAGE REGULATOR,PACKAGE(inches):SOT-23-5, PART NO:S-1132B31-M5T1U, MAKE:ABLIC , VOLTAGE REGULATOR. - VOLTAGE REGULATOR,PACKAGE(inches):SOT-23-5, PART NO:S-1132B33-M5T1U, MAKE:ABLIC Total Quantity : 1