

Department of Higher Education has published Bids Are Invited For High Performance Computing ( Hpc ) Cluster - A. Master Cum Storage Node ( Quantity 1 Unit ) ( I ) Processor ( Ii ) Memory ( Iii ) Security Feature ( Iv ) Hard Disk Drives & Ssds ( V ) Hdd Bays ( Vii ) Free I / O Slots ( P. Submission Date for this Tender is 12-11-2021. Cutting Crimping and Punching Tools Tenders in Jammu And Kashmir. Bidders can get complete Tender details and download the document.
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