Wafer Dicing Tool Wafer Dicing Tool , Wafer Dicing Tool ( As Per Annexure-I Attached In Tender Document )

Tender Notice

28697020
Corrigendum : Wafer Dicing Tool Wafer Dicing Tool , Wafer Dicing Tool ( As Per Annexure-I Attached In Tender Document )
Indian
Rajasthan
03-09-2021
17-09-2021
21-09-2021

Tender Details

Wafer Dicing Tool Wafer Dicing Tool , Wafer Dicing Tool ( As Per Annexure-I Attached In Tender Document )

Corrigendum Details

Sr No CorrigendumDate Corrignedum CorrigendumType NewSubmissionDate
1 27-Aug-2021 Bid Auto Extn Corrigendum Bid Auto Extn Corrigendum 03-09-2021
2 03-Sep-2021 Date Extension Date 17-09-2021

Key Value

Document Fees
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EMD
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Tender Value
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BOQ Items

Name of Work: Wafer Dicing tool
Sl. No. Item Description
1Wafer Dicing tool (As per Annexure-I attached in Tender Document)
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