}
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    • Wafer Dicing Tool Wafer Dicing Tool , Wafer Dicing Tool ( As Per Annexure-I Attached In Tender Document ) , IIT Jodhpur, NH-62, Nagaur Road, Karwar, Jodhpur-Rajasthan

    Indian Institute Of Technology-IITB has published Wafer Dicing Tool Wafer Dicing Tool , Wafer Dicing Tool ( As Per Annexure-I Attached In Tender Document ) . Submission Date for this Tender is 17-09-2021. Machine Tools Tenders in IIT Jodhpur, NH-62, Nagaur Road, Karwar, Jodhpur Rajasthan. Bidders can get complete Tender details and download the document.




    Tender Notice

    28697020
    Corrigendum : Wafer Dicing Tool Wafer Dicing Tool , Wafer Dicing Tool ( As Per Annexure-I Attached In Tender Document )
    Open Tender
    Indian
    Rajasthan
    IIT Jodhpur, NH-62, Nagaur Road, Karwar, Jodhpur
    17-09-2021

    Tender Details

    Wafer Dicing Tool Wafer Dicing Tool , Wafer Dicing Tool ( As Per Annexure-I Attached In Tender Document )

    Corrigendum Details

    Sr No CorrigendumDate Corrignedum CorrigendumType NewSubmissionDate
    1 27-Aug-2021 Bid Auto Extn Corrigendum Bid Auto Extn Corrigendum 03-09-2021
    2 03-Sep-2021 Date Extension Date 17-09-2021

    Key Value

    Document Fees
    Refer document
    EMD
    Refer document
    Tender Value
    Refer document
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