Educational and Research Institute Boards / Undertakings / PSU Closing in 0 days TDR #26223859

Supply Of Lab Equipments For R & D Lab Advanced Research And Innovation Centre Department Of Electronics And Communication, Uit Rgpv

Issued by Boards / Undertakings / PSU · RGPV, Bhopal, Madhya Pradesh
Tender Value
64.50 Lakhs
Estimated cost
Bid Submission
11 Jan 2021
0 days left
EMD
1.93 Lakhs
Bank guarantee accepted
Document Fee
5000
Non-refundable
Tender Type
Online

Tender Overview

Competition Type
NCB
Bidding Type
Tender
Location / State
RGPV, Bhopal → Madhya Pradesh
EMD Exemption
Not Available
Quantity
Not Available

Project Description

Supply Of Lab Equipments For R & D Lab Advanced Research And Innovation Centre Department Of Electronics And Communication, Uit Rgpv-High Definition Real Time Image Processing Package ( Fpga Development Kit 1 Multi-Touch Lcd Module 2 Hdmi-Tx 2 Hdmi-Rx 2 8 Mega Pixel Digital Camera Package 2 Pciex4 Cabling Adapter & Cable 2 ) 2. High Speed Dsp Development Board ( Development Kit 1 Ad / Da Data Conversion Card 2 Pingalab With Maya ( Four Packages With 5 User ) 2 ) 3. Advanced Digital System Development With Partial Reconfiguration And Open Cl ( Fpga Development Board 1 Fpga Educational Development Board 10 Rf & Sensor Interface Card 5 Servo Motor Kit With Power Supply 5 Intel Fpga Icb Hsmc Card 2 ) 4. Embedded System ( Lite Board 5 Video Embedded Evaluation Kit 2 ) 5. Soc Development Package ( Soc Development Board 5 ) 6. Educational Laboratory Virtual Instruments Suite 7. Rio With Starter, Embedded And Mechatronics Sensor Kit 8. Software Defined Radio Reconfigurable Input Output 9. Virtual Bench

Corrigendum

Sr No Corrigendum Date Corrigendum Type New Submission Date
1 26-Dec-2020 Last date Extend Date 11-Jan-2021

AI Tender Summary

OUR REF NO 26223859
AUTHORITY Boards / Undertakings / PSU
TENDER VALUE 64.50 Lakhs
LAST DATE 11-01-2021
Authority
Authority Name Rajiv Gandhi Proudyogiki Vishwavidyalay
Work Description Supply Of Lab Equipments For R & D Lab Advanced Research And Innovation Centre Department Of Electronics And Communication, Uit Rgpv-High Definition Real Time Image Processing Package ( Fpga Development Kit 1 Multi-Touch Lcd Module 2 Hdmi-Tx 2 Hdmi-Rx 2 8 Mega Pixel Digital Camera Package 2 Pciex4 Cabling Adapter & Cable 2 ) 2. High Speed Dsp Development Board ( Development Kit 1 Ad / Da Data Conversion Card 2 Pingalab With Maya ( Four Packages With 5 User ) 2 ) 3. Advanced Digital System Development With Partial Reconfiguration And Open Cl ( Fpga Development Board 1 Fpga Educational Development Board 10 Rf & Sensor Interface Card 5 Servo Motor Kit With Power Supply 5 Intel Fpga Icb Hsmc Card 2 ) 4. Embedded System ( Lite Board 5 Video Embedded Evaluation Kit 2 ) 5. Soc Development Package ( Soc Development Board 5 ) 6. Educational Laboratory Virtual Instruments Suite 7. Rio With Starter, Embedded And Mechatronics Sensor Kit 8. Software Defined Radio Reconfigurable Input Output 9. Virtual Bench
Basic Detail
Tender No RGPV/RUSA/2020/4306/3
Bidding Type Tender
Location
City RGPV, Bhopal
State Madhya Pradesh
Key Dates
Publish Date 26 Dec 2020
Submission Date 11 Jan 2021
Open Date 12 Jan 2021
Finance
Tender Value 64.50 Lakhs
Tender Fee 5000
EMD 1.93 Lakhs
Exemption Not Available
Document List
BFE90ADC-ADF5-43D8-886F-C5343BD99BD1.html

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Tender Timeline

Dec 26, 2020
11:30 IST

Tender Published

Tender notice published.

Completed
Jan 11, 2021
18:00 IST

Corrigendum-1 Issued

Clarifications on tender conditions and amendments issued.

Completed
Jan 11, 2021
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Completed
Jan 12, 2021

Bid Opening Date

Technical bids will be opened and evaluated.

Completed

Tender Documents

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