

College Of Engineering has published 1. Resin Bonded Diamond Grinding Disc For Plane Grinding Of Materials Hv 150- 2000.Grit Size 500. For Maynetic Fixation On Polishing Disc 20Omm (8”) Dia. 2. Resin Bonded Diamond Grinding Disc For Plane Grinding Of Materials Hv 150- 2000.Grit Size 12O0.. Submission Date for this Tender is 24-02-2020. Abrasive Wheels Tenders in West Bengal. Bidders can get complete Tender details and download the document.
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