}
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    • Supply Of Pm6 Auto Precision Lapping And Polishing Machine (Ii) Triple Station Wafer Substrate Bonding Unit With Pump (Iii) Ncg-2 Non-Contact Thickness Measurement Gauge (Iv) Aws1 Abrasive Wire Saw With Consumables, DIRECTOR, SSPL, DELHI-Delhi

    Department Of Defence Research And Development has published Supply Of Pm6 Auto Precision Lapping And Polishing Machine (Ii) Triple Station Wafer Substrate Bonding Unit With Pump (Iii) Ncg-2 Non-Contact Thickness Measurement Gauge (Iv) Aws1 Abrasive Wire Saw With Consumables. Submission Date for this Tender is 02-03-2020. Grinding Sanding and Polishing Equipment Tenders in DIRECTOR, SSPL, DELHI Delhi. Bidders can get complete Tender details and download the document.




    Tender Notice

    23416807
    Supply Of Pm6 Auto Precision Lapping And Polishing Machine (Ii) Triple Station Wafer Substrate Bonding Unit With Pump (Iii) Ncg-2 Non-Contact Thickness Measurement Gauge (Iv) Aws1 Abrasive Wire Saw With Consumables
    Vendor Enlistment
    Indian
    Delhi
    Director, Sspl, Delhi
    02-03-2020

    Tender Details

    Supply Of Pm6 Auto Precision Lapping And Polishing Machine ( Ii ) Triple Station Wafer Substrate Bonding Unit With Pump ( Iii ) Ncg-2 Non-Contact Thickness Measurement Gauge ( Iv ) Aws1 Abrasive Wire Saw With Consumables

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