Supply Of 1 Processor 2 Mother Board I — Chipset Features 3 Ram Ram 4 Upgradability Anc Sots 5 Hdd 6 Chassis 7 Comnunication 1/O Ports 8 Keyboard & Mouse 9 Camera I?_ Graphics Sound Card 12 Display Battery Type 14 Weight 1S Wwreles
Tender Overview
Project Description
Supply Of 1 Processor 2 Mother Board I — Chipset Features 3 Ram 4 Ram Upgradability Anc Sots 5 Hdd 6 Chassis 7 Comnunication 1/O Ports 8 Keyboard & Mouse 9 Camera 10 Graphics 11 Sound Card 12 Display Battery Type 14 Weight 15 Wireless & Bluetooth Power And Supply 16 os/ media, certification, carry case
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Offline submission at the designated office.
CompletedTender Documents
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