Tenders Are Invited For Special-Purpose Machine Tools-Delivery Of Two Identical Advanced Surface Grinding Systems Designed Specifically For Grinding Semiconductor Substrates, Such As Gallium Nitride (Gan) And Silicon Carbide (Sic).

Special-Purpose Machine Tools-Delivery Of Two Identical Advanced Surface Grinding Systems Designed Specifically For Grinding Semiconductor Substrates, Such As Gallium Nitride (Gan) And Silicon Carbide (Sic).. Please Scroll Down For The English Version The Subject Of The Order Is Delivery Of Two Identical Advanced Surface Grinding Systems Designed Specifically For Grinding Semiconductor Substrates Such As Gall Nitride (Gan) And Silicon Carbide (Sic). Purchase Of Two Identical Grinders: Requirements For The Specifications Of The Grinders • The Grinder Is Designed Specifically For Grinding Semiconductor Wafers, Such As Gall Nitride (Gan) And Silicon Carbide (Sic). • Single -Shaped Grinder For Processing Waffles Individually • The Ability To Process Waffle With A Diameter Of 25 Mm To 150 Mm • Possibility To Use Grinding Discs From Any Supplier Dimensions Of The Grinder: • Base Area: Less Than: 1.5 M (Width) X 2.2 M (Main) X 2.5 M (Height) • Weight: Less Than: 5 Tons Of Sanding Platform: • Spindles: At Least 1 Μm/500 N • Rated Moment:> 22 Nm • Adjusting The Slope Of The Grinding Disc In Axis With 3-Point Support • Feed Speed: 5 Mm/S • Cutting: 0.01– (10.0) Μm/S • Resolution For The Axis With: 0.01 Μm Measurement Of The Thickness Of The Wafer: • Function Measurement Function. Real Time Working Table: • Rotational Speed: Minimum 300 Rpm • Supported Sizes Of Workpiece, Available Working Tables: Ø 25.4 Mm Ø 49 Mm Ø 50.8 Mm Ø 101.6 Mm • Porsatu Material: Ceramics Grinding Shield: • Diameter Of The Grinding Disc: From 200 Mm To 300 Mm • Discable Speed: Minimum 2500 Rpm • Required Adjustment Of The Slope Of The Grinding Disc: Osi Unit Z (Column) With 3-Point Support • A System That Allows You To Adjust The Position Of The Grinding Shield Relative To The Vacuum Table To Ensure Parallelness • Repeatability: 0.5 Μm The Contracting Authority Informs That The Project, Under Which This Order Is Implemented, Is Co-Financed By The European Union, And Is Obliged To Keep The Principle Damage (Dnsh), In Accordance With Art. 17 Regulation (Eu) 2020/852. In Connection With The Above, The Contractor Is Obliged To Ensure That The Subject Of The Contract: • Does Not Cause Significant Damage To The Eu Environmental Purposes, Which Are: Mitigating Climate Change, Adaptation To Climate Change, Sustainable Use Of Water Resources, Closed Circulation Economy, Pollution Prevention And Protection Of Biodiversity And Ecosystems; • Does Not Contain Prohibited Substances In Accordance With The Regulations Of Reach And Rohs; • Enables Energy -Saving Operation And Limitation Of Waste; • Meets The Requirements For The Possibility Of Recovery, Recycling Or Safe Utilization After Operation. 1. To Confirm That The Offered Subject Of The Contract Is Produced In Accordance With The Dnsh Principle, The Contractor Whose Offer Was Selected As The Most Advantageous Present: 1.1. Declaration Of Ce, Rohs, Reach Or Equivalent Compliance. 1.2. Characteristics Cards (Sds), 1.3. Catalog Cards Or Instructions Containing Environmental Information. And If The Product Is Not Subject To

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FileName	File Description
Global Tender Document	Tender Notice