Tenders Are Invited For Direct Cooling System For High Performance, High Power (300W Class) Telecom Signal Processing Components (Artes At 4D.087) - Expro+

Tenders are invited for Direct Cooling System for High Performance, High Power (300w Class) Telecom Signal Processing Components (Artes at 4d.087) - Expro+ Objective: The objective of the activity is to design, develop and test an active two-phase cooling system capable to remove in the order of 300Watts from a single electronic component (e.g.switch/router Integrated Circuit).Targeted Improvements:Increase by at least a factor of 5 the maximum thermal dissipation of signal processing components that can be supported on a spacecraft.Description: Modern satellite telecommunications systems are moving towards on board regenerative payloads, capable of routing high throughput real time traffic across the system. As a result, satellite technology providers and integrators have started considering powerful digital integrated circuits, often developed for the terrestrial market, with extremely highpowerconsumption and dissipation (in the range of several hundreds of Watts), creating an unprecedented thermal bottleneck at component level (factor 6 to 10 increase ofthermal dissipation with respect to heritage space grade devices). In order to able to dissipate the large amount of power witha very high heat flux density, new technics such as microchannel cooling, direct spray cooling or jet impingement cooling, already utilised in terrestrial applications, will need to be studied, traded-off and developed. The design of the integrated circuits will need as well to consider thermal aspects (e.g. internal thermal gradients). The availability of a high performing component thermal management solutionwill as well benefit other highly dissipative elements of the payload and platform, such as Power Field Effect Transistors (FET) commonly used in many equipment and RF amplifiers.This activity will start with a comprehensive state-of-the-art technology survey with corresponding trade-offs to select a preferred technical solution and implementation architectures to support the use of high dissipation components in the next generation of spacecraft platform and payloads. A representative breadboard of theselected technology(ies) will be designed, built and tested to evaluate the performance of the cooling system. Finally, the activity will identify key remaining risks in the technology and the necessary developmentactivities that would be required to generate the corresponding space suitable commercial solution. Tender Link : https://esastar-publication-ext.sso.esa.int/ESATenderActions/filter/open