Tenders Are Invited For Electromechanical Equipment-Chemical-Mechanical Polisher Ii./Chemical-Mechanical Polisher Ii.

Electromechanical Equipment-Chemical-Mechanical Polisher Ii./Chemical-Mechanical Polisher Ii.. The Subject Of This Public Contract Is The Supply Of Equipment For Abrasive Thinning And Polishing Boards From Semiconductor Materials Including Installation, Commissioning And Training. The Device Will Use The Technology Of Chemical And Mechanical Polishing By Rotating Shoulder With The Help Of Finely Abrasive Emulsion And Etching Solutions. It Will Be Used For Thinning And Planarization Of Semiconductor Materials. The Device And The Chemistry Used Will Be Covered And The System Will Be Including Storage Space For Storage And Removal Of Chemical Waste. The Purpose Of The Required Equipment Is To Polish And Thinner Substrates From Semiconductor Materials, Which Will Improve The Technological Level In The Back-Or-Of-Line Production Of Chip Components And Samples. The Subject Of The Public Contract Is Defined In Detail By The Technical, Business And Other Contractual Conditions That Are Part Of The Tender Documentation.