Tenders Are Invited For Microelectronic Machinery And Apparatus-Procurement Of A Thin-Layer Division System

Microelectronic Machinery And Apparatus-Procurement Of A Thin-Layer Division System. - Factory Acceptance Test (Fat), Web -Based Or Included On Site - Installation, Training And Site Acceptance Test (Sat) With User Training Included - Ce Marking For The Overall System - Maximum Dimensions Of The System: Height 2.95M X Width 2.60M , If This Dimensions Are Exceeded, Consultation Is Required By Sending The System Layout. Depending On The System Layout, An Exceedance Can Lead To Exclusion From The Award Procedure, The Decision On This Is Made By The Western Saxony University Of Applied Sciences Zwickau. - The Overall System Must Contain All System Components Necessary For Regular Operation (Cladding, Rack Mountain, In -Plant Piping, Hoses, Control Units, Ads ...) Transfer And Chamber System: At Least 3 Port Transfer Chamber System, Optional 4 Port, Depending On System Configuration - Port 1 : Cassetten Load Lock For The Inlet Of Samples - Port 2: Sputter Module - Port 3: Free, With The Option Of A Later Retrofitting Of An Evaporator (Thermal / Electron Beam) - Port 4: Free, With The Option Of A Later Retrofit Of A Wafer User, Only Necessary If The Sputter Module In Sputter Down Configuration Is Offered. Handling System, Automatically Or Manually With> 10 Million Mcbf Sputter Module In Sputter Down Configuration. - End Effectors For 150Mm Wafers / Carriers - Min. A Cassette For 150Mm Wafer With 12 Carriers For 100Mm Wafer And Smaller Samples - Wafer In Diameter Of 150Mm Should Be With And Without Flat / Notch In A Thick Area Of ​​200-1000 Μm Or Another Thickness Area Can Be Edited. - The Processing Of 100Mm Wafers (With And Without Flat, 200-1000 Μm Thick Or Another Thick Area) Should Be Possible By Using The Supplied Carrier. - Min. 6 Carrier With A High Thermal Mass, Which Can Make The Use Of Substrate Heating Impossible, But Must Be Used Without The Expansion Of Substrathitus. Pump And Gas System - Turbopumps To Load Lock, Process And Transfer Chambers - Oil -Free Preliminary Vacuum Pumps In All The Digits Necessary For The Function Of The System - Gas Control System For Process Gases Ink. Mfcs - Process Gases: Ar, N2, O2, H2 / Ch4, In Any Compositions, But Hardware Interlock On O2 Gasline, Blocked For Operation With H2 Or Ch4 - Process Gases In The Process Module: N2 Rinse Valve Mfc For Ar With Individual One / Exterior Valve Mfc For O2 With An Individual Insertion/Exterior Valve And Hardware Interlock Against H2 And Ch4 Mfc For N2 With An Individual Insertion/Off-Valve Mfc For H2/Ch4 With An Individual Input/Ex-Valve Software-System Control Software With Storable Process Recipes And Possible Automated Process Flow - Data Recording Of The Relevant Process Parameters, Min. Time, Process Module Pressure, Gas Flow, Performance. - Several User Levels, From Level 2 Password -Protected, Min: 1 Only Process Start Recipes 2 Process Start And Modification Or Reciper Position 3 Manual System Control Process Module -