GTR 90173826
Tenders Are Invited For Xinlian Microelectronics Company Limited 12Inch High Density Plasma Dry Etch Tool-Si Etch And 12Inch High Density Plasma Dry Etch Tool-Metal Etch(2)
ICB — International Competitive Bid
Closed
Eastern Asia
Tender Information
GTR Reference
90173826
Tendering Authority
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Tender No
0613-244025125010
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Xinlian Microelectronics Company Limited 12Inch High Density Plasma Dry Etch Tool-Si Etch And 12Inch High Density Plasma Dry Etch Tool-Metal Etch(2)
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
07-01-2025
Closed
Work Detail
12inch High density plasma dry etch tool-Si ETCH, 12inch High density plasma dry etch tool-Metal ETCH
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
70e86f72-8e3a-4214-b0ad-e8f309ffda9f.html
Attachments
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- Publication Document (Tender Document / Tender Notice)
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