GTR 89703279
Tenders Are Invited For Xinlian Microelectronics Company Limited 12Inch High Density Plasma Dry Etch Tool-Si Etch And 12Inch High Density Plasma Dry Etch Tool-Metal Etch(1)
ICB — International Competitive Bid
Closed
Eastern Asia
Tender Information
GTR Reference
89703279
Tendering Authority
Subscribe to view
Tender No
0613-244025125010
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Xinlian Microelectronics Company Limited 12Inch High Density Plasma Dry Etch Tool-Si Etch And 12Inch High Density Plasma Dry Etch Tool-Metal Etch(1)
Bid Type
ICB — International Competitive Bid
Country
Subscribe to view
Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
27-12-2024
Closed
Work Detail
12inch High density plasma dry etch tool-Si ETCH, 12inch High density plasma dry etch tool-Metal ETCH
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
e96a6a7c-7231-4fc5-8ab7-c18b96b2edd3.html
Attachments
Additional Details Available on Click
- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
Disclaimer
We take all possible care for accurate & authentic tender information. However, users are requested to refer to the original Tender Notice / Tender Document published by the Tender Issuing Agency before taking any decision regarding this tender.